Copper and its alloys are structural materials used in industries and engineering applications due to their excellent thermal and electrical conductivity and chemical stability. Integrating graphene, known for its exceptional electrical conductivity, into the copper matrix is a promising strategy to enhance mechanical properties without sacrificing electrical conductivity. The Accumulative Roll Bonding (ARB) process can effectively and homogeneously introduce graphene into the metal matrix and is adaptable to an industrial scale. This study investigates the impact of varying graphene concentrations and two heat treatment protocols (without a controlled atmosphere) on the mechanical and electrical properties of ARBed copper/graphene composites. Optical microscopy revealed minimal voids and graphene clumps, and the energy dispersive spectroscopy analysis revealed the absence of copper oxide in some samples. The conductivity test showed little influence of the graphene content and stress relief heat treatment temperature on electrical conductivity (~86% of the International Annealed Copper Standard) within a limited number of ARB cycles. The tensile tests did not reveal a significant influence of the graphene content and stress relief heat treatment temperature on the ultimate tensile strength (220–420 MPa) and elongation (~2%).

The Cu-8.5wt % Sn alloy presents an extensive microsegregation during its solidification. That microsegregation results in the formation of a eutectoid mixture, which is detrimental to subsequent forming processes. This study deals with the influence of solidification time and cooling rate on the microstructure of that alloy. The unidirectional solidification technique allowed the acquisition of thermal data. The optical microscopy enabled the microstructural characterization of the material, the measurement of dendrite arm spacings and the quantification of the volume fraction of the eutectoid mixture. A semi-analytical mathematical model was proposed to estimate the volume fraction of the eutectoid mixture. The model expresses the volume fraction as an implicit function of the Fourier number. The results showed that the microstructure is dendritic and that the characteristic spacings increase with the solidification time between theliquidusand the peritectic temperatures. The data also showed that for higher cooling rates the dendrite arm spacings are smaller and that there is a tendency for the volume fraction of eutectoid mixture in the columnar zone to increase with the Fourier number and to decrease with the cooling rate. The proposed model allowed obtaining values of volume fraction with the same order of magnitude of the experimental data, but with behavior tendency opposite to that observed.