The defects and subsurface damages induced by crystal growth and micro/nano-machining have a significant impact on the functional performance of machined products. Raman spectroscopy is an efficient, powerful, and non-destructive testing method to characterize these defects and subsurface damages. This paper aims to review the fundamentals and applications of Raman spectroscopy on the characterization of defects and subsurface damages in micro/nano-machining. Firstly, the principle and several critical parameters (such as penetration depth, laser spot size, and so on) involved in the Raman characterization are introduced. Then, the mechanism of Raman spectroscopy for detection of defects and subsurface damages is discussed. The Raman spectroscopy characterization of semiconductor materials’ stacking faults, phase transformation, and residual stress in micro/nano-machining is discussed in detail. Identification and characterization of phase transformation and stacking faults for Si and SiC is feasible using the information of new Raman bands. Based on the Raman band position shift and Raman intensity ratio, Raman spectroscopy can be used to quantitatively calculate the residual stress and the thickness of the subsurface damage layer of semiconductor materials. The Tip-Enhanced Raman Spectroscopy (TERS) technique is helpful to dramatically enhance the Raman scattering signal at weak damages and it is considered as a promising research field.

A plasmonic lens with metallic chirped circular nanoslits corrugated on Au film supported on quartz substrate for the purpose of superfocusing was put forth and fabricated by means of focused ion beam direct milling technique. Topography of the lens was imaged using an atomic force microscope. After that a near-field scanning optical microscope was employed for optical characterization of focusing performance of the lens. Our experimental results verify the focusing performance and further demonstrate that they are in agreement with the theoretical calculation results. Focusing performance is significantly improved in comparison to that of the non-chirped lens. The lenses are possible to be used for the applications of bioimaging, detection, and inspection in submicron scale resolution.

A novel method with high flexibility and efficiency for developing SERS substrates is proposed by patterning nanostructures on Si substrates using focused ion beam direct writing (FIBDW) technology following with precise thermal evaporation of gold film on the substrate. The effect of SERS on the substrate was systematically investigated by optimizing the processing parameters and the gold film thickness. The results proved that small dwell time could improve the machining accuracy and obtain smaller nanogap. The Raman-enhanced performance of the substrate was investigated with 10⁻⁶mol/L Rhodamine 6 G solution. It was indicated that the elliptic nanostructures with 15-nm spacing on Si substrates, coated with approximately 15-nm thick gold film, have exhibited a high-enhanced performance, but dramatic performance degradation was found as the gold film thickness further increased, which most probably resulted from changes of the nanostructures’ morphology such as elliptical tip and spacing. To avoid the morphological changes effectively after depositing gold film, optimization design of the nanostructures for FIBDW on Si substrates was proposed. Besides, a similar phenomenon was found when the gold film was less than 15nm because there was little gold remaining on the substrate. The method proposed in this paper shows a great potential for the higher performance SERS substrates development, which can further reduce the spacing between hot spots.

In the past few decades, colloidal self-assembly method has been widely investigated and developed. The colloidal particle size can range from tens of nanometers to a few microns to develop one-dimensional (1D) to three-dimensional (3D) superstructures. It can fabricate from simple single layer to the multi-layer structures, and even more complex structures, like a variety of linear, circular and particles clusters with different shapes, etc. Secondary particles can also be realized through the self-assembly process with primary particles, such as polymer, inorganic or metal particles, even the inorganic and polymer composites. This review will summarize several typical and traditional self-assembly routes, and introduce their recent progress and innovations from the several aspects mentioned above. Meanwhile, due to the high accuracy and special properties of nanostructured materials or devices constructed with colloidal assembly, this review will also discuss their potential applications in the fields of physics, chemistry, biology and so on.