Wire bonding is one of the commanding interconnection techniques used at the back end of line due to its vast adaptability to the advancing trend of circuit designs. Wire bond shear test method is utilized to examine adhesion strength of the bonded wires. In this paper, the stress response of copper ball bond during wire bond shear test is investigated The influences of three types of bond pad surface; flat surface, hemisphere surface and sharp groove surface on the stress response of copper ball bond during wire bond shear test were evaluated. The simulation was done using Ansys version 11.The simulation results showed the bond pad surface had a significant influence on the stress response of copper ball bond. At the shear ram displacement distance of 35μm, the peak stress responses for all three bond pad surface were obtained.

Purpose: The increased use recently of area‐array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area‐array solder interconnection. As the interconnection technology for flip chip package is getting finer and smaller, it is extremely difficult to obtain the accurate values of thermal stresses by direct experimental measurements. Different types of solder bumps used for interconnection would also influence the thermal distribution within the package. Because the solder balls are too small for direct measurement of their stresses, finite element method (FEM) was used for obtaining the stresses instead.Design/methodology/approach: This paper will discuss the results of the thermal stress distribution using numerical method via ABAQUS software. The variation of the thermal stress distribution with the temperature gradient model was evaluated to study the effects of the different material thermal conductivity of solder bumps used. A detailed 2D finite element model was constructed to perform 2D plain strain elastoplastic analysis to predict areas of high stress.Findings: It is found that thermal distribution of solder bumps starts to propagate from the top region to the bottom region of the solder balls. Other than that, thermal stress effect increases in parallel with the increasing of the temperature. The simulation results shows that leaded solder balls, SnPb have higher maximum thermal stress level compared to lead‐free SAC solder balls.Originality/value: The paper describes combination of stress with thermal loading correlation on a flip chip model. The work also shows how the different thermal conductivity on solder balls influences the thermal induced stress on the flip chip package.

As the trend for semiconductor packaging is heading towards BGA and flip chip interconnection methods, the conventional wire bonding process still dominates the industry primarily due the flexibility of wire bonds. The reliability of the bonded wires is assessed through wire bond shear test. In this study, the effects of shear ram speed on the stress response of bonded wires during wire bond shear test were investigated. The stress response of two wire materials, gold(Au) and copper(Cu) at varied shear ram speed were evaluated.A 3D non-linear finite element model was developed for the simulation. The shear ram speed of 100 μm/sand 1mm/s were used in this study. The results showed that the shear ram speed has significant effects on the stress response of the bonded wire. The simulation was done using Ansys version 11.

Breast carcinoma is a life threatening disease that accounts to 25.1% of all carcinoma among women worldwide. Early detection of the disease enhances the chance for survival. This paper presents comprehensive report on breast carcinoma disease and its modalities available for detection and diagnosis, as it delves into the screening and detection modalities with special focus placed on the non-invasive techniques and its recent advancement work done, as well as a proposal on a novel method for the application of early breast carcinoma detection. This paper aims to serve as foundation guidance for the reader to attain bird’s eye understanding on breast carcinoma disease and its current non-invasive modalities.

Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.