Acrylonitrile–butadiene–styrene (ABS) filled with 6 wt.% of multi-walled carbon nanotubes and graphene nanoplatelets was extruded in filaments and additively manufactured via fused deposition modeling (FDM). The electrical conductivity and electromagnetic interference shielding efficiency (EMI SE) in the frequency range between 8.2 and 12.4 GHz of the resulting 3D samples were assessed. For comparison purposes, compression molded samples of the same composition were investigated. Electrical conductivity of about 10⁻⁴ S·cm⁻¹ and attenuations of the incident EM wave near 99.9% were achieved for the 3D components loaded with multi-walled carbon nanotubes, almost similar to the correspondent compression molded samples. Transmission electron microscopy (TEM) images of ABS composite filaments show that graphene nanoplatelets were oriented along the polymer flow whereas multi-walled carbon nanotubes were randomly distributed after the extrusion process. The electrical conductivity and electromagnetic interference (EMI) shielding properties of compression molded and FDM manufactured samples were compared and discussed in terms of type of fillers and processing parameters adopted in the FDM process, such as building directions and printing patterns. In view of the experimental findings, the role of the FDM processing parameters were found to play a major role in the development of components with enhanced EMI shielding efficiency.

In this research, poly(lactic acid) (PLA) nanocomposites with multi-walled carbon nanotubes (MWCNT) were produced by extrusion, injection, and compression molding, focusing on electromagnetic shielding. Various amounts of carbon nanotubes (MWCNTs) were tested in PLA matrix, specifically ranging from 1 to 4 parts per hundred resin (phr). The resulting nanocomposites were analyzed before and after undergoing annealing heat treatment. It was observed that as the MWCNT content increased, the melt flow index of PLA decreased. This reduction indicates that the nanotubes were effectively accommodated into the PLA chain. The PLA/MWCNT (2 phr) formulation presented the greatest balance of properties, with potential for electromagnetic shielding application. Scanning electron microscopy (SEM) demonstrated that incorporating 2 phr of carbon nanotubes in PLA promoted good distribution, favoring high electrical conductivity and electromagnetic shielding between 20–22 dB (8.2–18 GHz), corresponding to approximately 99% attenuation. Furthermore, its properties, such as elastic modulus (3156 MPa), tensile strength (65.1 MPa), hardness (77.8 Shore D), and heat deflection temperature (55.3 °C), increased compared to pure PLA. After annealing, the PLA/MWCNT (2 phr) nanocomposite underwent a molecular reordering, resulting in an increased crystalline fraction, as confirmed by X-ray diffraction (XRD). However, the electrical conductivity maintained the same order of magnitude, while the electromagnetic shielding varied from 19.7 to 20 dB. The results indicate that these nanocomposites are promising for electromagnetic shielding applications and can be manufactured in the molten state.

Magnetic ionic liquid (MIL) based on alkyl phosphonium cation was used as a curing agent for developing epoxy nanocomposites (ENCs) modified with a graphene nanoplatelet (GNP)/carbon nanotube (CNT) hybrid filler. The materials were prepared by a solvent-free procedure involving ball-milling technology. ENCs containing as low as 3 phr of filler (GNP/CNT = 2.5:0.5 phr) exhibited electrical conductivity with approximately six orders of magnitude greater than the system loaded with GNP = 2.5 phr. Moreover, the use of MIL (10 phr) resulted in ENCs with higher conductivity compared with the same system cured using conventional aliphatic amine. The filler dispersion within the epoxy matrix was confirmed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The electromagnetic interference shielding effectiveness (EMI SE), evaluated in the X- and Ku-band frequency range, revealed a great contribution of the absorption mechanism for the ENC containing the hybrid filler and cured with MIL. Moreover, the best microwave-absorbing response was achieved with the ENC containing GNP/CNT = 2.5/0.5 phr, and cured with ML, which a minimum RL of −23.61 dB and an effective absorption bandwidth of 5.18 GHz were observed for thickness of 1.5 mm. In summary, this system is a promising material for both civilian and military applications due to its simple and scalable nanocomposite preparation method, the lightweight nature of the composites resulting from the low filler content, the commercial availability and cost-effectiveness of GNP, and its high electromagnetic wave attenuation across a broad frequency range.

The application of graphene nanoplatelets (GNPs) in polymer composites is a challenge due to their high tendency to agglomerate and restack during processing. In this work, alkyl phosphonium-based ionic liquid was used to assist the dispersion of GNP in an ethylene-vinyl acetate (EVA) matrix, through a melt-mixing procedure. The mechanical properties and creep resistance of the films prepared by the film extrusion process were evaluated. The results demonstrated that the noncovalent treatment of GNP with the ionic liquid (IL) enhanced the electrical conductivity and creep stability of the EVA composites. The microwave absorbing properties were studied in the X-band and Ku-band. A reflection loss (RL) of −15 dB for EVA containing 0.5 wt% of GNP and 1:1 wt% of GNP/IL was achieved. The use of a multi-layered structure containing thin film layers was efficient for enhancing the microwave absorbing performance, with a minimum RL of −24.6 dB and effective absorption bandwidth of 4.3 GHz. This result is attributed to the internal reflection and scattering of the radiation between layers. The use of simple, low-cost materials and procedures, combined with the system’s excellent mechanical and electrical properties, makes it a promising candidate for multifunctional applications as electrostatic dissipative and microwave absorbing materials for electronic packaging and other electronic devices.