The III-V compound semiconductor, which has the advantage of wide bandgap and high electron mobility, has attracted increasing interest in the optoelectronics and microelectronics field. The poor electronic properties of III-V semiconductor surfaces resulting from a high density of surface/interface states limit III-V device technology development. Various techniques have been applied to improve the surface and interface quality, which cover sulfur-passivation, plasmas-passivation, ultrathin film deposition, and so on. In this paper, recent research of the surface passivation on III-V semiconductors was reviewed and compared. It was shown that several passivation methods can lead to a perfectly clean surface, but only a few methods can be considered for actual device integration due to their effectiveness and simplicity.

The passivation effects of SF₆ plasma on zinc oxide (ZnO) films prepared by magnetron sputtering were researched. After the SF₆ plasma passivation of ZnO films, the grain size increases, there is low surface roughness, and a small amount of Zn-F bonds are formed, resulting in the narrowing of band gap. The photoluminescence (PL) intensity of SF₆-passivated ZnO films has a 120% increase compared to the untreated samples, and the reduction in defects can increase the resistivity and stability of ZnO films. ZnO films are used in the preparation of ZnO/p-Si heterojunction diodes. The results of the measurement of current voltage (J–V) show that the reverse current is reduced after SF₆ plasma passivation, indicating an improvement in the electrical properties of ZnO films.

The passivation effects of the SF₆ plasma on a GaAs surface has been investigated by using the radio frequency (RF) plasma method. The RF’s power, chamber pressure, and plasma treatment time are optimized by photoluminescence (PL), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). The PL intensity of passivated GaAs samples is about 1.8 times higher than those which are untreated. The oxide traps and As-As dimers can be removed effectively by using SF₆ plasma treatment, and Ga-F can form on the surface of GaAs. It has also been found that the stability of the passivated GaAs surface can be enhanced by depositing SiO₂ films onto the GaAs surface. These indicate that the passivation of GaAs surfaces can be achieved by using SF₆ plasma treatment.