Photoinduced guided index changes approaching 10−4 in the range 488–784 nm, measured using a simple interferometric technique, are reported in germanosilicate single-mode optical fibers exposed to the 488-nm line of an Ar+ laser running multifrequency. The wavelength dependence and dynamics of the writing process are characterized, and the material dispersion of the induced Δn(λ) is shown to be weak. The effect is placed in the context of related research on color centers in these fibers, and two different mechanisms are proposed that lead to quantitative estimates in rough agreement with the measured Δn values.
Fresh experimental and theoretical results on thermally induced catastrophic breakdown (the fiber fuse) in optical fibers are presented, including the observation that the damage is not always irreversible and an analysis of the complex unsteady absorption–heat-conduction process that controls the effect. Good agreement with experiment is obtained with just two independent parameters. The analysis shows that the fiber fuse is a new kind of solitary thermal shock wave in whose leading edge the temperature gradients can reach several thousand kelvins per micrometer.
We report on the development of hollow-core photonic bandgap fibers for the delivery of high energy pulses for precision micro-machining applications. Short pulses of (65ns pulse width) and energies of the order of 0.37mJ have been delivered in a single spatial mode through hollow-core photonic bandgap fibers at 1064nm using a high repetition rate (15kHz) Nd:YAG laser. The ultimate laser-induced damage threshold and practical limitations of current hollow-core fibers for the delivery of short optical pulses are discussed.
Conventional manufacturing of glass microfluidic devices is a complex, multi-step process that involves a combination of different fabrication techniques, typically photolithography, chemical/dry etching and thermal/anodic bonding. As a result, the process is time-consuming and expensive, in particular when developing microfluidic prototypes or even manufacturing them in low quantity. This report describes a fabrication technique in which a picosecond pulsed laser system is the only tool required to manufacture a microfluidic device from transparent glass substrates. The laser system is used for the generation of microfluidic patterns directly on glass, the drilling of inlet/outlet ports in glass covers, and the bonding of two glass plates together in order to enclose the laser-generated patterns from the top. This method enables the manufacturing of a fully-functional microfluidic device in a few hours, without using any projection masks, dangerous chemicals, and additional expensive tools, e.g., a mask writer or bonding machine. The method allows the fabrication of various types of microfluidic devices, e.g., Hele-Shaw cells and microfluidics comprising complex patterns resembling up-scaled cross-sections of realistic rock samples, suitable for the investigation of CO2 storage, water remediation and hydrocarbon recovery processes. The method also provides a route for embedding small 3D objects inside these devices.
We present high average power picosecond and nanosecond pulse delivery at 1030 nm and 1064 nm wavelengths respectively through a novel hollow-core Negative Curvature Fiber (NCF) for high-precision micro-machining applications. Picosecond pulses with an average power above 36 W and energies of 92 µJ, corresponding to a peak power density of 1.5 TWcm−2 have been transmitted through the fiber without introducing any damage to the input and output fiber end-faces. High-energy nanosecond pulses (>1 mJ), which are ideal for micro-machining have been successfully delivered through the NCF with a coupling efficiency of 92%. Picosecond and nanosecond pulse delivery have been demonstrated in fiber-based laser micro-machining of fused silica, aluminum and titanium.
We report picosecond laser welding of similar and dissimilar materials based on plasma formation induced by a tightly focused beam from a 1030 nm, 10 ps, 400 kHz laser system. Specifically, we demonstrate the welding of fused silica, borosilicate, and sapphire to a range of materials including borosilicate, fused silica, silicon, copper, aluminum, and stainless steel. Dissimilar material welding of glass to aluminum and stainless steel has not been previously reported. Analysis of the borosilicate-to-borosilicate weld strength compares well to those obtained using similar welding systems based on femtosecond lasers. There is, however, a strong requirement to prepare surfaces to a high (10–60 nm Ra) flatness to ensure a successful weld.