This study concerns the simulation of copper electrodeposition and related phenomenological and technological aspects as influenced by electrode geometry and electrolyte flow velocity. A multiphysics simulation approach was employed, integrating mathematical models accounting for electrochemical deposition and hydrodynamic behavior. Ionic transport is described by the Nernst-Planck equations, electrode kinetics by Butler–Volmer expressions, and fluid flow by the Navier–Stokes equations. Simplified 2D and 3D models were developed to investigate industrial frame plating electrodeposition processes. The results indicate that the fluid direction of the solution in relation to the position of the substrate within the electrodeposition cell enables the distribution of the thickness of the coating to be optimized. Numerical simulation can be used to guide the choice of the orientation of cathodes to be electroplated inside the electroplating tank, to take into consideration agitation direction, and to achieve the best deposit uniformity.