The micromechanical silicon resonant accelerometer has attracted considerable attention in the research and development of high-precision MEMS accelerometers because of its output of quasi-digital signals, high sensitivity, high resolution, wide dynamic range, anti-interference capacity and good stability. Because of the mismatching thermal expansion coefficients of silicon and glass, the micromechanical silicon resonant accelerometer based on the Silicon on Glass (SOG) technique is deeply affected by the temperature during the fabrication, packaging and use processes. The thermal stress caused by temperature changes directly affects the frequency output of the accelerometer. Based on the working principle of the micromechanical resonant accelerometer, a special accelerometer structure that reduces the temperature influence on the accelerometer is designed. The accelerometer can greatly reduce the thermal stress caused by high temperatures in the process of fabrication and packaging. Currently, the closed-loop drive circuit is devised based on a phase-locked loop. The unloaded resonant frequencies of the prototype of the micromechanical silicon resonant accelerometer are approximately 31.4 kHz and 31.5 kHz. The scale factor is 66.24003 Hz/g. The scale factor stability is 14.886 ppm, the scale factor repeatability is 23 ppm, the bias stability is 23 μg, the bias repeatability is 170 μg, and the bias temperature coefficient is 0.0734 Hz/°C.

In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm² chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.

In this paper, we present a novel low-loss splice for use between the photonic bandgap fiber (PBGF) and the conventional solid-core fiber to make PBGFs more functional. Furthermore, the hollow-core and the holes in the cladding of PBGF act as gas pipes. Using the proposed splice, a measurement system for low gas concentrations based on the PBGF cell has been developed and implemented. Experiments for measuring ammonia (NH₃) gas at the ppm level were performed. The basic peak agreed well with the database of the Pacific Northwest National Laboratory (PNNL), meaning that this method can be used to accurately and effectively measure gas concentration. The constructed gas cells are compact and cost-effective for sensitive, rapid, and continuous measurement of gases.

The quartz tuning fork (QTF) being the acoustic-electrical conversion element for quartz-enhanced photoacoustic spectroscopy (QEPAS) system directly affects the detection sensitivity. However, the low electromechanical conversion efficiency characteristic of standard QTF limits the further enhancement of the system. Therefore, the optimized design for QTF is becoming an important approach to improve the performance of QEPAS. In this work, 9 kHz T-shaped QTFs with isosceles-trapezoidal grooves are firstly applied to gas sensing experiments. Four types of 9 kHz QTFs are fabricated and applied to gas detection experiments. Simulation results reveal QTFs with isosceles-trapezoidal grooves are conducive to optimizing the stress distribution and enhancing electromechanical conversion efficiency. The results of the gas sensing experiment (acetylene C₂H₂) indicate that the signal peak and signal-to-noise ratio values of T-shaped QTF with positive isosceles-trapezoidal grooves can reach 1.44 and 1.85 times greater than the normal QTF with rectangular cross-section prongs.

In this study, a miniaturized high fundamental frequency quartz crystal microbalance (QCM) is fabricated for sensor applications using a wet etching technique. The vibration area is reduced in the fabrication of the high frequency QCM with an inverted mesa structure. To reduce the complexity of the side wall profile that results from anisotropic quartz etching, a rectangular vibration area is used instead of the conventional circular structure. QCMs with high Q values exceeding 25,000 at 47 MHz, 27,000 at 60 MHz, 24,000 at 73 MHz and 25,000 at 84 MHz are fabricated on 4 × 4 mm² chips with small vibration areas of 1.2 × 1.4 mm². A PMMA-based flow cell is designed and manufactured to characterize the behavior of the fabricated QCM chip in a liquid. Q values as high as 1,006 at 47 MHz, 904 at 62 MHz, 867 at 71 MHz and 747 at 84 MHz are obtained when one side of the chip is exposed to pure water. These results show that fabricated QCM chips can be used for bio- and chemical sensor applications in liquids.

The quartz double‐ended tuning fork (DETF) resonator is well known to be sensitive to longitudinal force and is widely used as the sensing element in modern accelerometer, force and pressure sensors. The quartz DETF resonator works in‐plane, with anti‐phase flexural mode vibration, which is driven into oscillation by internal strains created by AC voltages applied to electrode patterns on the beams. The DETF vibration modes and vibration characteristics are determined by the electrode pattern and its electromechanical coupling efficiency. Presented are three kinds of electrode patterns for different applications, and the effect of electrode patterns on the vibration performances are investigated experimentally. With the fundamental frequency at 65 KHz, the DETF resonator is designed and fabricated using the wet etching‐based quartz MEMS technique. The vibration characteristics including Q‐ value, and equivalent parameters, are evaluated using a 4294 A impedance analyser. Experimental results demonstrated that the vibration characteristics of quartz DETFs are affected by the electrode patterns including pattern location and widths. These results are expected to be useful for designing quartz DETF based devices.