Al-Mg alloys are characterized by permanent solid solution hardening and can additionally be work-hardened. The high mechanical properties of Al-Mg alloys with above-standard Mg content obtained after plastic deformation processes decrease over time. The addition of minor alloying elements like Er or Zr is an alternative method to improve the durability of mechanical properties and increase the strength of Al-Mg alloys due to densely and evenly distributed dispersoids being formed. In this paper, Al-Mg alloys with above-standard Mg content (7 wt.%) and Zr and Er micro-alloying elements and their influence on the microstructure and durability of the mechanical properties were examined. The cast ingots of AlMg7 alloys were characterized by a smooth surface without cracks. The plastic deformation process in a static compression test resulted in an about 60 HBW increase in the Brinell hardness of all the deformed alloys relative to casting. It was revealed that the addition of Er and Zr significantly improved the mechanical properties and durability of the mechanical properties of the Al-Mg after annealing. The addition of Er or Zr slightly restrained the decrease in the Brinell hardness after annealing but did not inhibit it.

Aluminum multifunctional housings can enhance circularity in electronics by replacing polymer enclosures while integrating heat sinking and electronic functions via laser direct structuring (LDS). Within the ALU4CED concept, we applied an IR-compatible LDS lacquer on aluminum, formed conductive tracks by electroless Cu/Ni/Au metallization, assembled components, and assessed end-of-life recyclability. Controlled remelting trials compared three disassembly levels: complete housings with PCBs and components, housings without PCBs, and housings with only integrated tracks. Metal yield rose from 81.4% for complete assemblies to 93.2% after PCB removal, while leaving integrated LDS tracks did not measurably penalize recovery. Only the complete electronics variant showed critical contamination (Cu = 1.64 wt.% vs. 0.25 wt.% limit for EN AC 4343); after PCB removal, composition remained close to the reference and major elements (Si, Mg, Fe) stayed within specification. Prefil testing indicated very low total inclusion content (0.006/0.001/0.002 mm²·kg⁻¹), confirming high melt cleanliness despite coatings. Following remelting → billet casting → extrusion, tensile properties (Rm ≈ 120–123 MPa, Rp0.2 ≈ 59–61 MPa, A ≈ 29–33%) were comparable to the reference profile. These results demonstrate the technological feasibility of closed-loop recycling for LDS functionalized aluminum housings and inform clear Design-for-Recycling guidance: design for rapid PCB removal, allow LDS layers to remain during melting, and maintain compatibility with the 4343 family to enable efficient internal recycling.