Despite the demand for personalized wound care, integrating diagnostics and therapeutics into a unified platform remains a significant challenge. To address this, we developed a 3D-printed theranostic hydrogel using vat photopolymerization, enabling precise, multifunctional wound management. The hydrogel matrix, composed of poly(acrylamide-co-hydroxyethyl acrylate) and carboxymethyl cellulose, was chemically crosslinked with poly(ethylene glycol) diacrylate. Bromocresol purple was integrated into the photosensitive resin to enhance printing fidelity and serve as a diagnostic indicator, providing a distinct colorimetric shift upon skin infection. For controlled drug delivery, graphene oxide (GO) and levofloxacin were incorporated into the system. The 3D-printed hydrogel demonstrated superior swelling capacity (>600%), ideal for absorbing wound exudate. A semi-quantitative linear colorimetric response was observed across varying pH levels, allowing for clear differentiation between healthy healing skin (pH 4.0–6.0) and infected conditions (pH 7.0 and above). Furthermore, the hydrogel exhibited infection-stimulated therapy, with a cumulative levofloxacin release of 92.63% at pH 8, significantly higher than in acidic conditions. Moreover, the incorporation of GO further optimized the delivery profile by tuning absorption and release rates. Synergizing real-time monitoring and on-demand therapeutic action, this 3D-printed system offers a scalable, robust solution for future-ready, personalized wound management.

Additive Manufacturing (AM) process parameters significantly influence the thermal, mechanical, and surface roughness properties of printed parts. While experimental characterization is highly accurate, it is often excessively time-consuming and costly, hindering the development of scalable predictive models. This study adopts a Materials Informatics approach to curate a multi-sourced benchmarking dataset comprising 543 entries for ABS, PLA, and TPU filaments, integrating data from web-scraping (WSDS), literature (LDDS), and manufacturer technical datasheets (MTDS). Data cleaning included outlier detection via Tukey’s fences and the evaluation of imputation strategies, with K-Nearest Neighbors (KNN) consistently outperforming simple mean/median methods. We evaluated three regression models, Random Forest (RF), Ridge Regression (RR), and Support Vector Regression (SVR), using a nested cross-validation pipeline to predict tensile strength, elongation, and surface roughness. The results reveal significant data gaps in existing literature, with missingness exceeding 60% for critical parameters like fan speed and wall thickness. While the Random Forest model achieved high predictive accuracy for bulk mechanical properties, specifically a test-set R2 of 0.995 for PLA elongation, all models struggled with surface roughness, often yielding negative R2 values. This suggests that current process descriptors are insufficient to capture the stochastic nature of surface morphology. This work provides a foundational benchmarking dataset for the research community and highlights the necessity for stricter data mining protocols and more sophisticated feature engineering to achieve reliable predictive quality in material extrusion (MEX) polymers.

Alumina (Al ₂ O ₃ ) is a technical ceramic widely selected for demanding applications due to its excellent material properties, such as high strength, corrosion resistance, and thermal stability. In this study, the effect of the sintering temperature of 3D-printed alumina to its surface characteristics and its subsequent performance as a copper-metallized ceramic substrate was investigated. Green parts of alumina samples were prepared using stereolithography (SLA) 3D printing, debound, then sintered at temperatures ranging from 1660°C to 1740°C. Surface roughness was quantified using Atomic Force Microscopy (AFM), while the copper layer's adhesion was assessed via tape and burnishing tests. Electrical conductivity was measured with a four-point probe. A non-monotonic relationship between sintering temperature and surface roughness was observed. Roughness (Ra) decreased as temperature increased from 1660°C to 1720°C, attributed to enhanced densification. However, increasing the temperature to 1740°C led to grain coarsening and a slight increase in roughness due to excessive grain growth. Stronger copper adhesion was achieved on smoother surfaces produced at optimized sintering temperatures. Electrical conductivity was also determined with a minimum sheet resistance of 0.089 mΩ/sq achieved.