To study the micromorphology and dynamic evolution law of copper aluminum composite interface evolution, ultra-high temperature laser Confocal microscopy (CLSM) was used to observe and analyze the evolution of copper aluminum interface in situ, and then SEM, EDS and other advanced material analysis methods were used to observe the micromorphology of the composite layer, and study the composition of the interface layer and the formation process of the copper aluminum composite interface. The results indicate that the formation of the copper aluminum composite interface layer is mainly related to the mutual diffusion of copper aluminum atoms and the interface reaction between copper and aluminum. The bonding of the copper aluminum composite interface is mainly related to the melting of the metal surface of the interface layer and the mutual diffusion of copper aluminum atoms, which is the main mechanism of the copper aluminum composite interface bonding. The intermetallic compound is mainly Al₂Cu. In situ, observation of copper aluminum composite interface shows that there is a clear and relatively flat boundary between copper and the interface layer, while the boundary between aluminum and the interface layer is not straight, which is caused by the difference in thermal expansion coefficient, Lattice constant and hardness between intermetallic compounds and matrix and between intermetallic compounds. At the same time, it was found that there is a certain relationship between the visual changes of the copper aluminum composite interface image and reaction-diffusion migration during in-situ observation using a confocal laser scanning high-temperature microscope. Moreover, under no pressure, the oxide layer and interface inclusions can seriously affect the interface bonding.

In this work, using the high-throughput density functional theory calculation method, the influence of 36 alloying elements on the elastic properties of FCC-Cu was systematically studied, and based on the Labusch model, a linear relationship was fitted between the composition and lattice parameters, and the shear modulus. The solid solution strengthening behavior brought about by alloying was studied quantitatively. The results showed that most alloying elements have solid solution potentiality in copper. The change in the elastic modulus and the strengthening effect of alloying on solid solutions were determined by the elements’ positions in the periodic table. In the same period, the alloying elements located in the middle of the period tended to enhance the elastic modulus of copper, while the elements located at both ends have greater solid solution strengthening ability. The predicted results are in good agreement with the experimental values, which provide theoretical guidance for the design of high-performance copper alloys.

This study investigates how Zr doping influences the deformation behavior of Cu-Zr/Al₂Cu/Al composites through molecular dynamics simulations. The impact of Zr content (ranging from 0 to 0.8 wt%) and strain rate on phase evolution, dislocation dynamics, and fracture mechanisms under vertical and horizontal tensile loading was examined. The results indicate that Zr doping achieves a balance between strength and plasticity by means of solute drag, amorphization, and phase competition. At a Zr concentration of 0.2 wt%, the formation of the body-centered cubic (BCC) phase reached a peak (22.04% at ε = 0.11), resulting in a maximum tensile strength of 9.369 GPa while maintaining plasticity due to limited face-centered cubic (FCC) decomposition. A moderate Zr content of 0.6 wt% maximizes strength through amorphization but significantly diminishes plasticity due to excessive FCC-to-BCC transitions. Higher Zr concentrations (0.8 wt%) lead to solute supersaturation, which suppresses phase transitions and slightly reduces toughness by causing hexagonal close-packed (HCP) phase accumulation. The strain rate markedly enhances both strength and plasticity in vertical loading by accelerating dislocation interactions. Vertical tensile deformation initiates brittle fracture, whereas horizontal loading results in ductile failure through sequential load transfer from Al₂Cu layers to Al/Cu interfaces, ultimately causing interfacial decohesion. These findings underscore the essential roles of Zr content and strain rate in modulating phase transformations and interface responses. The research offers a framework for creating gradient Zr-doped or multi-scale composites with optimized strength, plasticity, and damage tolerance suitable for aerospace and electronics applications, where trace Zr additions can reinforce Cu matrices.

In this study, first-principles calculations were employed to systematically investigate the adsorption of Cl⁻ on Al₂Cu(110) surfaces, clean Al(111)/Al₂Cu(110) interfaces, and Fe/Si-doped interfaces, as well as the influence of strain on interfacial electronic structure and corrosion activity. When Cl⁻ is adsorbed on Al sites, the bonding between Cl and Al exhibits strong ionic characteristics with localized charge transfer, while adsorption on Cu sites is characterized by more delocalized, covalent interactions. This competition dictates the site-dependent stability of adsorption. Through geometric–electronic synergy, the interface functions as both a “Cl⁻ enrichment zone” and an “activity source,” significantly favoring Cl⁻ adsorption at high-activity anodic sites such as Al-hole and Al-bridge. Conversely, Cu-top sites maintain a high work function and an inert cathodic nature, facilitating the formation of efficient micro-galvanic couples across the interface. Moreover, Fe/Si doping further modulates the interfacial electronic landscape: Si serves as an effective strengthening element due to its low substitution energy and high stability, while Fe primarily forms a solid solution on the Al side, potentially introducing galvanic corrosion risks. Stress analysis indicates that tensile strain systematically enhances surface activity by lowering the work function, while compressive strain non-monotonically influences corrosion through a three-stage mechanism involving the “densification–cracking–plastic relaxation” of the passive film. These findings elucidate the atomistic origins of corrosion initiation at Cu–Al composite interfaces and provide a theoretical foundation for enhancing corrosion resistance through alloy design and strain engineering.

This study investigates the cooling process of the Cu/Al₂Cu/Al system following high-temperature diffusion using molecular dynamics (MD) simulations based on an embedded atom method potential. The analysis focused on various characteristics to determine the structural and property changes within the Cu/Al₂Cu/Al system during cooling. The findings reveal that only a small number of Cu atoms diffused along the Z-axis near the Cu/Al₂Cu interface, while significant diffusion of Al atoms occurs in all directions at the Al/Al₂Cu interface. Moreover, 673 K is identified as a crucial temperature for the crystal transformation of the Cu/Al₂Cu/Al system during cooling. The Cu/Al₂Cu interface exhibited migration behavior along the positive Z-axis. Additionally, the growth of Al₂Cu towards the Al side resulted in a symmetrical lattice distribution along the Al/Al₂Cu interface, leading to the formation of a twin crystal. In the AI layer, locally disordered atoms transform into vacancies under stress, accumulating as the temperature drops, thereby providing favorable conditions for dislocation initiation. Notably, cooling of the Al layer to 650 K led to the initial generation of 1/6 Shockley incomplete dislocations.

Homogeneous TC4 titanium alloy suffers from the strength–ductility trade-off and exhibits insufficient anti-penetration capacity under high-strain-rate impact. TiC_p-reinforced functionally graded titanium matrix composites (FGTMCs) with a “hard outer, tough inner” gradient architecture are promising lightweight armor materials. The use of Abaqus/Explicit finite element simulation for FGTMCs under dynamic impact can capture transient deformation and damage evolution while enabling rapid evaluation of the impact resistance of different materials; however, research in this area remains scarce. This study conducts a systematic parametric analysis of key simulation parameters, including calibration of the Johnson–Cook constitutive and damage model parameters for TC4 titanium alloy, optimization of mesh partitioning strategies, hourglass control schemes, model dimensions, and boundary conditions to suppress “ghost mesh” numerical artifacts. Material property assignments for TC4 and three typical titanium matrix composites are designed, along with a methodology for constructing functionally graded material models. Two projectile–target matching configurations (small projectile/thin target vs. large projectile/thick target) are compared, and the optimal model of a 700 m/s small-caliber tungsten projectile impacting a 50 mm TC4 target is identified. Parametric analysis demonstrates that a damage parameter D4 = 0.1 significantly improves numerical stability, and a graded mesh strategy with further refinement along the penetration path balances computational accuracy and efficiency. Using the optimized material system, the simulation results reproduce the three-stage damage evolution of titanium alloys under impact—cratering, plastic penetration, and back-face spallation—providing reliable numerical support for the structural optimization of graded armor materials.