Scandium nitride (ScN) is an emerging indirect bandgap rocksalt semiconductor that has attracted significant attention in recent years for its potential applications in thermoelectric energy conversion devices, as a semiconducting component in epitaxial metal/semiconductor superlattices and as a substrate material for high quality GaN growth. Due to the presence of oxygen impurities and native defects such as nitrogen vacancies, sputter-deposited ScN thin-films are highly degenerate n-type semiconductors with carrier concentrations in the (1–6) $\times$ 10²⁰ cm⁻³ range. In this letter, we show that magnesium nitride (Mg_xN_y) acts as an efficient hole dopant in ScN and reduces the n-type carrier concentration, turning ScN into a p-type semiconductor at high doping levels. Employing a combination of high-resolution X-ray diffraction, transmission electron microscopy, and room temperature optical and temperature dependent electrical measurements, we demonstrate that p-type Sc_1-xMg_xN thin-film alloys (a) are substitutional solid solutions without Mg_xN_y precipitation, phase segregation, or secondary phase formation within the studied compositional region, (b) exhibit a maximum hole-concentration of 2.2 $\times$ 10²⁰ cm⁻³ and a hole mobility of 21 cm²/Vs, (c) do not show any defect states inside the direct gap of ScN, thus retaining their basic electronic structure, and (d) exhibit alloy scattering dominating hole conduction at high temperatures. These results demonstrate Mg_xN_y doped p-type ScN and compare well with our previous reports on p-type ScN with manganese nitride (Mn_xN_y) doping.

Reduction of cross-plane thermal conductivity and understanding of the mechanisms of heat transport in nanostructured metal/semiconductor superlattices are crucial for their potential applications in thermoelectric and thermionic energy conversion devices, thermal management systems, and thermal barrier coatings. We have developed epitaxial (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices with periodicity ranging from 1 nm to 240 nm that show significantly lower thermal conductivity compared to the parent TiN/(Al,Sc)N superlattice system. The (Ti,W)N/(Al,Sc)N superlattices grow with [001] orientation on the MgO(001) substrates with well-defined coherent layers and are nominally single crystalline with low densities of extended defects. Cross-plane thermal conductivity (measured by time-domain thermoreflectance) decreases with an increase in the superlattice interface density in a manner that is consistent with incoherent phonon boundary scattering. Thermal conductivity values saturate at $1.7\mathrm{W}{\mathrm{m}}^{-1}{\mathrm{K}}^{-1}$ for short superlattice periods possibly due to a delicate balance between long-wavelength coherent phonon modes and incoherent phonon scattering from heavy tungsten atomic sites and superlattice interfaces. First-principles density functional perturbation theory based calculations are performed to model the vibrational spectrum of the individual component materials, and transport models are used to explain the interface thermal conductance across the (Ti,W)N/(Al,Sc)N interfaces as a function of periodicity. The long-wavelength coherent phonon modes are expected to play a dominant role in the thermal transport properties of the short-period superlattices. Our analysis of the thermal transport properties of (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices addresses fundamental questions about heat transport in multilayer materials.

Device failure from diffusion short circuits in microelectronic components occurs via thermally induced migration of atoms along high-diffusivity paths: dislocations, grain boundaries, and free surfaces. Even well-annealed single-grain metallic films contain dislocation densities of about 10¹⁴ m⁻²; hence dislocation-pipe diffusion (DPD) becomes a major contribution at working temperatures. While its theoretical concept was established already in the 1950s and its contribution is commonly measured using indirect tracer, spectroscopy, or electrical methods, no direct observation of DPD at the atomic level has been reported. We present atomically-resolved electron microscopy images of the onset and progression of diffusion along threading dislocations in sequentially annealed nitride metal/semiconductor superlattices, and show that this type of diffusion can be independent of concentration gradients in the system but governed by the reduction of strain fields in the lattice.

Nitrate is a crucial environmental pollutant, and its risk on ecosystem keeps increasing. Photocatalytic conversion of nitrate to ammonia can simultaneously achieve the commercialization of environmental hazards and recovery of valuable ammonia, which is green and sustainable for the planet. However, due to the thermodynamic and kinetic energy barriers, photocatalytic nitrate reduction usually involves a higher selectivity of the formation of nitrogen that largely limits the ammonia synthesis activity. In this work, we reported a green and facile synthesis of novel metallic ruthenium particle modified graphitic carbon nitride photocatalysts. Compare with bulk graphitic carbon nitride, the optimal sample had 2.93-fold photocatalytic nitrate reduction to ammonia activity (2.627 mg/h/g _cat ), and the NH ₃ selectivity increased from 50.77% to 77.9%. According to the experimental and calculated results, the enhanced photocatalytic performance is attributed to the stronger light absorption, nitrate adsorption, and lower energy barrier for the generation of ammonia. This work may provide a facile way to prepare metal modified photocatalysts to achieve highly efficient nitrate reduction to ammonia.

Scandium nitride (ScN) is an emerging rock salt III-nitride semiconductor and has attracted significant interest in recent years for its potential thermoelectric applications as a substrate for high-quality epitaxial GaN growth and as a semiconducting component for epitaxial single-crystalline metal/semiconductor superlattices for thermionic energy conversion. Solid-solution alloys of ScN with traditional III-nitrides such as Al_xSc_1−xN have demonstrated piezoelectric and ferroelectric properties and are actively researched for device applications. While most of these exciting developments in ScN research have employed films deposited using low-vacuum methods such as magnetron sputtering and physical and chemical vapor depositions for thermoelectric applications and Schottky barrier-based thermionic energy conversion, it is necessary and important to avoid impurities, tune the carrier concentrations, and achieve high-mobility in epitaxial films. Here, we report the high-mobility and high-thermoelectric power factor in epitaxial ScN thin films deposited on MgO substrates by plasma-assisted molecular beam epitaxy. Microstructural characterization shows epitaxial 002 oriented ScN film growth on MgO (001) substrates. Electrical measurements demonstrated a high room-temperature mobility of 127 cm²/V s and temperature-dependent mobility in the temperature range of 50–400 K that is dominated by dislocation and grain boundary scattering. High mobility in ScN films leads to large Seebeck coefficients (−175 μV/K at 950 K) and, along with a moderately high electrical conductivity, a large thermoelectric power factor (2.3 × 10⁻³ W/m-K² at 500 K) was achieved, which makes ScN a promising candidate for thermoelectric applications. The thermal conductivity of the films, however, was found to be a bit large, which resulted in a maximum figure-of-merit of 0.17 at 500 K.