An electrothermal Monte Carlo (MC) method is applied in this paper to investigate electron transport in submicrometer wurtzite GaN/AlGaN high-electron mobility transistors (HEMTs) grown on various substrate materials including SiC, Si, GaN, and sapphire. The simulation method is an iterative technique that alternately runs an MC electronic simulation and solves the heat diffusion equation using an analytical thermal resistance matrix method. Results demonstrate how the extent of the thermal droop in the I_d-V_ds characteristics and the device peak temperature depend upon both the biasing conditions and the substrate material type. Polarization effects are considered in the simulations, as they greatly influence electron transport in GaN/AlGaN HEMTs by creating a highly concentrated two-dimensional electron gas (2DEG) at the GaN/AlGaN interface. It is shown that a higher 2DEG density provides the devices with a better current handling capability but also increases the importance of the thermal effects

Recent experiments presented in by Iveland et al. [Phys. Rev. Lett. 110, 177406 (2013)] demonstrated that hot electron emission from cesiated p-contacts of III-nitride quantum-well (QW) light-emitting diodes (LEDs) coincides with the onset of the efficiency droop. We have carried out Monte Carlo simulations of hot-electron transport in realistic III-N LEDs. The simulations account for the hole population and all relevant electron scattering and recombination processes. We show that Auger recombination generates a significant hot electron population, which is temporarily trapped in the conduction band side-valleys, without decaying completely before reaching the p-contact. The leakage current due to electron overflow and thermal escape from the QWs is shown to have a minimal impact on the droop. We conclude that the experimentally observed hot electrons are created by Auger recombination in QWs, and that the Auger effect as the origin of the droop is the only consistent explanation for the experimental findings of Iveland et al., [Phys. Rev. Lett. 110, 177406 (2013)].

This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current copper interconnects, 2) process & growth of carbon nanotube interconnects compatible with back-end-of-line integration, and 3) modeling and simulation for circuit-level benchmarking and performance prediction. The focus is on the evolution of carbon nanotube interconnects from the process, theoretical modeling, and experimental characterization to on-chip interconnect applications. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a survey and informative cornerstone on carbon nanotube interconnects relevant to students and scientists belonging to a range of fields from physics, processing to circuit design.

Fundamental thermodynamic considerations reveal that efficient emission from an electrically injected light emitting diode (LED) can lead to the cooling of the device. This effect, known as electroluminescent (EL) cooling, has been identified decades ago, but it has not been experimentally demonstrated in semiconductors at practical operating conditions due to the extreme requirements set for the efficiency of the light emission. To probe the conditions of EL cooling in GaAs based light emitters, we have designed and fabricated LED structures with integrated photodiodes (PDs), where the optically mediated thermal energy transport between the LED and the PD can be easily monitored. This allows characterization of the fundamental properties of the LED and a path for eliminating selected issues encountered in conventional approaches for EL cooling, such as the challenging light extraction. Despite several remaining nonidealities, our setup demonstrates a very high directly measured quantum efficiency of 70%. To characterize the bulk part of the LED, we also employ a model for estimating the power conversion efficiency (PCE) of the LED, without the contribution of non-fundamental nonidealities such as photodetection losses. Our results suggest that the PCE of the LED peaks at around 105–115%, exceeding the 100% barrier required to reach the EL cooling regime by a clear margin. This implies that the LED component in our device is in fact cooling down by transporting thermal energy carried by the emitted photons to the PD. This provides a compelling incentive for further study to confirm the result and to find ways to extend it for practically useful EL cooling.