Operation speed and coherence time are two core measures for the viability of a qubit. Strong spin-orbit interaction (SOI) and relatively weak hyperfine interaction make holes in germanium (Ge) intriguing candidates for spin qubits with rapid, all-electrical coherent control. Here we report ultrafast single-spin manipulation in a hole-based double quantum dot in a germanium hut wire (GHW). Mediated by the strong SOI, a Rabi frequency exceeding 540 MHz is observed at a magnetic field of 100 mT, setting a record for ultrafast spin qubit control in semiconductor systems. We demonstrate that the strong SOI of heavy holes (HHs) in our GHW, characterized by a very short spin-orbit length of 1.5 nm, enables the rapid gate operations we accomplish. Our results demonstrate the potential of ultrafast coherent control of hole spin qubits to meet the requirement of DiVincenzo’s criteria for a scalable quantum information processor.

Silicon photonic integration has gained great success in many application fields owing to the excellent optical device properties and complementary metal-oxide semiconductor (CMOS) compatibility. Realizing monolithic integration of III-V lasers and silicon photonic components on single silicon wafer is recognized as a long-standing obstacle for ultra-dense photonic integration, which can provide considerable economical, energy-efficient and foundry-scalable on-chip light sources, that has not been reported yet. Here, we demonstrate embedded InAs/GaAs quantum dot (QD) lasers directly grown on trenched silicon-on-insulator (SOI) substrate, enabling monolithic integration with butt-coupled silicon waveguides. By utilizing the patterned grating structures inside pre-defined SOI trenches and unique epitaxial method via hybrid molecular beam epitaxy (MBE), high-performance embedded InAs QD lasers with monolithically out-coupled silicon waveguide are achieved on such template. By resolving the epitaxy and fabrication challenges in such monolithic integrated architecture, embedded III-V lasers on SOI with continuous-wave lasing up to 85 °C are obtained. The maximum output power of 6.8 mW can be measured from the end tip of the butt-coupled silicon waveguides, with estimated coupling efficiency of approximately -6.7 dB. The results presented here provide a scalable and low-cost epitaxial method for the realization of on-chip light sources directly coupling to the silicon photonic components for future high-density photonic integration.

Highly uniform (111)-faceted Si sawtooth with underlying hollow structures is formed by homo-epitaxy on a U-shaped patterned Si (001) substrate. With in-situ III-V growth on such substrates by the III-V/IV dual chamber molecular beam epitaxy, a high-quality GaAs film is obtained. The (111)-faceted sawtooth structures are found effectively annihilating the antiphase boundaries and terminating mostly the lattice mismatch induced dislocations at the III-V/Si interface, while the hollow structures can effectively reduce the thermal stress. The high-quality GaAs layers on (111)-faceted hollow Si (001) are measured with a threading dislocation density of ∼10⁶ cm⁻² via the electron channeling contrast image method. By implementing the designed structure, strong room-temperature emission of InAs/GaAs and InAs/InGaAs quantum dots (QDs) at both O-band (1300 nm) and C/L-band (1550 nm) telecommunication wavelengths are achieved on Si (001) substrates. The O-band emission of InAs/GaAs QDs on Si (001) shows similar intensity to that on the GaAs substrate.

A quantum dot (QD) mode-locked laser as an active comb generator takes advantage of its small footprint, low power consumption, large optical bandwidth, and high-temperature stability, which is an ideal multi-wavelength source for applications such as datacom, optical interconnects, and LIDAR. In this work, we report a fourth-order colliding pulse mode-locked laser (CPML) based on InAs/GaAs QD gain structure, which can generate ultra-stable optical frequency combs in the O-band with 100 GHz spacing at operation temperature up to 100°C. A record-high flat-top optical comb is achieved with 3 dB optical bandwidth of 11.5 nm (20 comb lines) at 25°C. The average optical linewidth of comb lines is measured as 440 kHz. Single-channel non-return-to-zero modulation rates of 70 Gbit/s and four-level pulse amplitude modulation of 40 GBaud/s are also demonstrated. To further extend the comb bandwidth, an array of QD-CPMLs driven at separate temperatures is proposed to achieve 36 nm optical bandwidth (containing 60 comb lines with 100 GHz mode spacing), capable of a total transmission capacity of 4.8 Tbit/s. The demonstrated results show the feasibility of using the QD-CPML as a desirable broadband comb source to build future large-bandwidth and power-efficient optical interconnects.

Monolithic integration of III-V laser sources on standard silicon-on-insulator (SOI) substrate has been recognized as an enabling technology for realizing Si-based photonic integration circuits (PICs). The Si-based ridge lasers employing III-V quantum dot (QD) materials are gaining significant momentum as it allows massive-scalable, streamlined fabrication of Si photonic integrated chips to be made cost effectively. Here, we present the successful fabrication of InAs/GaAs QD ridge lasers monolithically grown on {111}-faceted SOI hollow substrates. The as-cleaved Fabry-Perot (FP) narrow ridge laser is achieved with a relatively low threshold current of 50 mA at room temperature under pulse current operation. The maximum working temperature achieved is up to 80 oC. The promising lasing characteristics of such SOI-based InAs/GaAs QD ridge lasers with low threshold current and small footprint provide a viable route towards large-scale, low-cost integration of laser sources on SOI platform for silicon photonic integration purpose.