The continuous expansion of the market demand and scale of commercial amidoxime chelating resins has caused large amounts of resin to be discarded around the world. In this study, the waste amidoxime chelating resin was reutilized as an adsorbent for the removal and recovery of Pb(II), Cu(II), Cd(II) and Zn(II) ions from aqueous solutions. The physical morphology and chemical composition of the waste amidoxime chelating resin (WAC-resin) from the factory was characterized by the elemental analyzer, X-ray photoelectron spectroscopy and Fourier-transform infrared spectroscopy. The influence of the initial metal ions concentration, contact time, temperature and the solution pH on the adsorption performance of the metal ions was explored by batch experiments. It was shown that the optimal pH was 4. Kinetic studies revealed that adsorption process corresponded with the pseudo-second-order kinetic model and the adsorption isotherm was consistent with the Langmuir model. At room temperature, the adsorption capacities of WAC-resin for Pb²⁺, Cu²⁺, Zn²⁺ and Cd²⁺ reached 114.6, 93.4, 24.4 and 20.7 mg/g, respectively.

In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future.

Sn-0.7Cu-0.075Al solder alloy adding with Ce and La had been successfully prepared by applying ball-milling and vacuum arc remelting. The influence of Ce and La on microstructure and corrosion behavior of Sn-0.7Cu-0.075Al solder alloy was investigated. The results showed that Ce (La)-containing solders had refined grains and obvious directional tendency due to the dispersive refiner (CeO₂ and La₂O₃). Electrochemical potentiodynamic curves revealed three different stages of the reaction, including anodic and cathodic processes, prepassivation section, and stable passivation stages. The self-corrosion potential (E_corr) of alloys with Ce and La addition were a little bit more negative, hardly making a difference on corrosion occurrence. However, the corrosion current density (I_corr) and passivation current density (I_p) decreased by two-thirds and one-half respectively, which indicated a better corrosion resistant after adding rare earths. The recorded micrographs of corroded surface at different polarized points witnessed the formation of corrosion product film both on prepassivation and passivation stage. Moreover, the cross section of corrosion product film showed the coarse, loose film in Sn-0.7Cu-0.075Al solder and adherent, compact film in Ce (La)-containing solders, which further indicated an excellent anti-corrosion property.