Renewable, cost-effective and eco-friendly electrode materials have attracted much attention in the energy conversion and storage fields. Bagasse, the waste product from sugarcane that mainly contains cellulose derivatives, can be a promising candidate to manufacture supercapacitor electrode materials. This study demonstrates the fabrication and characterization of highly porous carbon aerogels by using bagasse as a raw material. Macro and mesoporous carbon was first prepared by carbonizing the freeze-dried bagasse aerogel; consequently, microporous structure was created on the walls of the mesoporous carbon by chemical activation. Interestingly, it was observed that the specific surface area, the pore size and distribution of the hierarchical porous carbon were affected by the activation temperature. In order to evaluate the ability of the hierarchical porous carbon towards the supercapacitor electrode performance, solid state symmetric supercapacitors were assembled, and a comparable high specific capacitance of 142.1 F g⁻¹ at a discharge current density of 0.5 A g⁻¹ was demonstrated. The fabricated solid state supercapacitor displayed excellent capacitance retention of 93.9% over 5000 cycles. The high energy storage ability of the hierarchical porous carbon was attributed to the specially designed pore structures, i.e., co-existence of the micropores and mesopores. This research has demonstrated that utilization of sustainable biopolymers as the raw materials for high performance supercapacitor electrode materials is an effective way to fabricate low-cost energy storage devices.

In conventional consumer electronics such as cell phones, lead-containing interconnects provide the conductive path between different circuit elements. Environmental concerns have led to a search for lead-free alternatives. In their Perspective, [ Li et al. ][1] review these efforts, which have focused on lead-free alloys and electrically conductive adhesives. Both of these approaches are showing promise, but no one lead-free interconnect material can serve as a substitute for the conventional tin-lead solder in all devices. [1]: http://www.sciencemag.org/cgi/content/full/308/5727/1419