The measurement results of a single-excitation petal-shaped capacitive encoder show strong periodic characteristics for nonlinear errors. This paper presents the analysis of periodic nonlinear errors in a single-excitation petal-shaped encoder in terms of three main aspects—sensitive structure processing error, circuit demodulation error, and installation error. Analytical and simulation results confirm that the first-, second-, and fourth-periodic electrical errors are caused by the misalignment of circuit parameters, non-uniform segmentation of the processing error, and cross interference of the electric field, respectively. Further experimental investigation reveals that the mechanical periodic error is caused by installation misalignment. Based on these analytical, simulation, and experimental results, the design of the capacitive encoder was optimized and a method based on harmonic components was applied to compensate the periodic nonlinear error of the encoder. Measurement results shows that the prototype which has 180 petal-shaped numbers can achieve a reduction of periodic nonlinear errors to less than 0.02° and its accuracy can be improved to 0.0006° after compensation over the full measurement range.

In this paper, a capacitive angle encoder monitored and sensed by ASIC with a sensitive structure fabricated by MEMS technology is proposed. The sensitive structure with a 27.5mm outer diameter is designed and optimized in a limited footprint to realize higher accuracy. After being fabricated by MEMS technology, it is integrated with an ASIC, realizing high fabrication accuracy and a small footprint at the same time. The ASIC is designed in an analog-digital hybrid architecture to achieve low power consumption as well as a small footprint. The analog part of the ASIC consists of a charge to voltage converter with capacitance cancellation array and a sigma-delta modulator (SDM) with a 3-bit quantizer. In the digital part of ASIC, the processor based on Cortex-M3 core is designed to perform angle calculation. The measurement result of the proposed angle sensor reveals that the power consumption is 250 mW from a single 5V supply, the bandwidth is over 130Hz, the resolution is 0.002° and the accuracy over the full range is 0.024°, indicating that the encoder has considerable potential for use in high-precision applications.

Structural thermal deformation is an important factor that affects the performance of MEMS devices. The mismatch of thermal expansion coefficient (CTE) between different materials is a major source. For single center supported MEMS devices, expansion difference between device and the substrate leads to the out of plane thermal deformation of the structure, resulting in the performance deterioration. This paper presents a thermal deformation suppression chip (TDSC) for single center supporting MEMS devices. It is fabricated by the MEMS process and consists of an upper plate and a lower plate. The materials of the upper and lower plates are the same as those of the device substrate and structure respectively. The principle of TDSC to suppress thermal deformation is material symmetry design. Single center anchor is adapted to connect the upper and lower plates. Besides, the center anchor can also isolate the packaging stress generated between TDSC and package shell. In this paper, center supported quadruple mass gyroscope (CSQMG) is used to verify the effect of TDSC. Finite element simulation shows that the thermal deformation suppression effect is determined by radius of TDSC anchor, and the deformation can be suppressed to 0. The conclusion is confirmed by White light interference experiment. In addition, the experiment results also show that the TDSC effectively reduce the thermal out-of-plane deformation after packaging, which is even better than that of the gyroscope without any packaging. It is further proved that TDSC can also significantly improve the temperature performance of the CSQMG. Moreover, the TDSC has simple process steps, small chip area, low cost, and is suitable for various MEMS devices with single center anchor.

In this paper, a novel electrodes design for in-plane measurement of single-structure quadruple mass multi-axis MEMS inertial devices is proposed to achieve the closed-loop x/y-axis acceleration measurement. The designed 45 ° tilting comb electrodes combine synovial comb electrodes and laminated comb electrodes and meet the same electrostatic force coefficient on quadruple mass, with structural symmetry design ensured. Theoretical formula is analyzed in detail, which provides guidance for simulation and design.