In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN–BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN–BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.

The principal aim of this research study is to discuss the influences and effects of the acetylation degree of chitosan on antibacterial properties, mechanism, and thermal properties. Various chitosan with different degrees of deacetylation (DD%) were dissolved in acetic acid solution to produce films. The basic structure of chitosan consists of different ratios of amine (−NH₂) and acetic (R-HNCO-R). The discussion in this research paper also includes bacteriostasis, sterilization antibacterial capabilities, thermal manufacturing properties, and mechanisms.