ZhuangJian Liu

Dr. ZhuangJian Liu

Institute of High Performance Computing, A*STAR, Singapore 138632, Singapore
orcid

Research Focus & Metrics

Academic Career Length

18Years (2009-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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30 January 2018 in Advanced Materials
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YJYing Jiang
Ying Jiang
ZLZhiyuan Liu
Zhiyuan Liu
NMNaoji Matsuhisa
Naoji Matsuhisa
DQDianpeng Qi
Dianpeng Qi
WLWan Ru Leow
Wan Ru Leow
XCXiaodong Chen
Xiaodong Chen

21 June 2017 in Nature Communications
Verified
Journal Article
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KJKyung-In Jang
Kyung-In Jang
KLKan Li
Kan Li
HCHa Uk Chung
Ha Uk Chung
Sheng XuSheng Xu
Sheng Xu
HJHan Na Jung
Han Na Jung
John A. RogersJohn A. Rogers
John A. Rogers
Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.

12 June 2024 in Nature Materials
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RARuth Theresia Arwani
Ruth Theresia Arwani
STSherwin Chong Li Tan
Sherwin Chong Li Tan
ASArchana Sundarapandi
Archana Sundarapandi
WGWei Peng Goh
Wei Peng Goh
YLYin Liu
Yin Liu
YLYuxin Liu
Yuxin Liu

22 November 2019 in Nature Communications
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YDYuanyuan Dou
Yuanyuan Dou
Zhenpei WangZhenpei Wang
Zhenpei Wang
WHWenqian He
Wenqian He
TJTianjiao Jia
Tianjiao Jia
ZhuangJian LiuZhuangJian Liu
ZhuangJian Liu
ZLZunfeng Liu
Zunfeng Liu
Spider silks show unique combinations of strength, toughness, extensibility, and energy absorption. To date, it has been difficult to obtain spider silk-like mechanical properties using non-protein approaches. Here, we report on an artificial spider silk produced by the water-evaporation-induced self-assembly of hydrogel fibre made from polyacrylic acid and silica nanoparticles. The artificial spider silk consists of hierarchical core-sheath structured hydrogel fibres, which are reinforced by ion doping and twist insertion. The fibre exhibits a tensile strength of 895 MPa and a stretchability of 44.3%, achieving mechanical properties comparable to spider silk. The material also presents a high toughness of 370 MJ m−3 and a damping capacity of 95%. The hydrogel fibre shows only ~1/9 of the impact force of cotton yarn with negligible rebound when used for impact reduction applications. This work opens an avenue towards the fabrication of artificial spider silk with applications in kinetic energy buffering and shock-absorbing.

28 September 2020 in Proceedings of the National Academy of Sciences
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HYHaicheng Yao
Haicheng Yao
WYWeidong Yang
Weidong Yang
Wen ChengWen Cheng
Wen Cheng
YTYu Jun Tan
Yu Jun Tan
HSHian Hian See
Hian Hian See
BTBenjamin C. K. Tee
Benjamin C. K. Tee
Electronic skins are essential for real-time health monitoring and tactile perception in robots. Although the use of soft elastomers and microstructures have improved the sensitivity and pressure-sensing range of tactile sensors, the intrinsic viscoelasticity of soft polymeric materials remains a long-standing challenge resulting in cyclic hysteresis. This causes sensor data variations between contact events that negatively impact the accuracy and reliability. Here, we introduce the Tactile Resistive Annularly Cracked E-Skin (TRACE) sensor to address the inherent trade-off between sensitivity and hysteresis in tactile sensors when using soft materials. We discovered that piezoresistive sensors made using an array of three-dimensional (3D) metallic annular cracks on polymeric microstructures possess high sensitivities (> 107 Ω ⋅ kPa−1), low hysteresis (2.99 ± 1.37%) over a wide pressure range (0–20 kPa), and fast response (400 Hz). We demonstrate that TRACE sensors can accurately detect and measure the pulse wave velocity (PWV) when skin mounted. Moreover, we show that these tactile sensors when arrayed enabled fast reliable one-touch surface texture classification with neuromorphic encoding and deep learning algorithms. Significance We show a near–hysteresis-free piezoresistive sensor system from soft materials by using a method of generating unique three-dimensional nanoscale crack morphologies on metal-coated elastomeric microstructures. Our method addresses the major challenge of inherent electromechanical hysteresis faced by many electronic sensor skins using soft materials when large compressive pressures are applied. Piezoresistive sensors made from our flexible composite material track deformation with <3% hysteresis and can be reliably used as a healthcare wearable device for measuring pulse wave velocity on a small skin patch. We also showed that the low hysteresis enabled accurate and reliable single-touch classification of surface textures on textile surfaces for robotic applications.

18 January 2024 in Composites Science and Technology
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Closed access
YCYonglin Chen
Yonglin Chen
ZJZhengyi Jin
Zhengyi Jin
WKWenbin Kang
Wenbin Kang
ZhuangJian LiuZhuangJian Liu
ZhuangJian Liu
Weidong YangWeidong Yang
Weidong Yang
YLYan Li
Yan Li