Dr. Tapas Mandal

School of Mechanical Engineering and IT, Yeungnam University, Gyeongsan 38541, Korea

Dr. Tapas Mandal

School of Mechanical Engineering and IT, Yeungnam University, Gyeongsan 38541, Korea

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Prof. Dionysios (Dion) Dionysiou University of Cincinnati, USA

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Prof. Xueliang (Andy) Sun Faculty of Engineering, The University of Western Ontario, London, Ontario N6A 5B9, Canada

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Prof. Ramakrishna Seeram Mechanical Engineering, National University of Singapore, Singapore 119077, Singapore

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Prof. Dr. Rui L. Reis University of Minho, I3B's - Research Institute on Biomaterials, Biodegradables and Biomimetics, Guimarães, Portugal

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Prof. Dr. Alexander A. Balandin Department of Electrical Engineering and Materials Science and Engineering Program, Bourns College of Engineering, University of California, Riverside, California 92521, USA

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Prof. Vincent M. Rotello Department of Chemistry, 710 North Pleasant St., University of Massachusetts, Amherst, MA 01003, USA

MDPI Editorial Member

Prof. Dionysios (Dion) Dionysiou University of Cincinnati, USA

MDPI Editorial Member

Prof. Xueliang (Andy) Sun Faculty of Engineering, The University of Western Ontario, London, Ontario N6A 5B9, Canada

MDPI Editorial Member

Prof. Ramakrishna Seeram Mechanical Engineering, National University of Singapore, Singapore 119077, Singapore

MDPI Editorial Member

Prof. Dr. Rui L. Reis University of Minho, I3B's - Research Institute on Biomaterials, Biodegradables and Biomimetics, Guimarães, Portugal

MDPI Editorial Member

Prof. Dr. Alexander A. Balandin Department of Electrical Engineering and Materials Science and Engineering Program, Bourns College of Engineering, University of California, Riverside, California 92521, USA

MDPI Editorial Member