Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4-phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1. In order to modify the dielectric constant (Dk), coefficient of thermal expansion (CTE) and other performances of laminates, Li₂TiO₃ (LT) ceramic powders were introduced into the resin matrix. The composite laminates showed low dielectric loss of 0.0026 at 10 GHz and relatively high flexural strength of 125 MPa when the mass ratio of LT fillers to resin is 0.4. Moreover, the composite laminates all maintain low water uptake (<0.5%). The microstructure and thermal properties of composite laminates filled with LT ceramic powders were also tested. These results show that copper clad laminates prepared with modified polyphenylene ether (MPPE)/SEBS and LT ceramic fillers have strong competitiveness to fabricate printed circuit boards (PCBs) for high-frequency and high-speed applications.

Multilayer molybdenum disulfide (MoS₂) was facilely prepared by a chelation-assisted sol–gel method with ammonium molybdate tetrahydrate ((NH₄)₆Mo₇O₂₄·4H₂O) as the molybdenum source, thioacetamide (CH₃CSNH₂) as the sulfur source and diethylenetriamine pentaacetic acid (Dtpa) as the chelating agent, subsequently followed by high-temperature calcination. The chelating agent Dtpa ingeniously mediated the chelation reaction of the system and promoted the formation of a monolithic gel. The hexagonal MoS₂ crystal (2H-MoS₂) with good crystallinity precipitated after calcination at 1000 °C with the Mo and S mass ratio of 1 : 3. The adjustable MoS₂ layers stacked together to form MoS₂ flakes, and these flakes aggregated to construct crystalline MoS₂ particles. The electrochemical tests showed the possibility of as-prepared MoS₂ crystals applied as a negative electrode for lithium ion batteries.

Polymer dielectric materials are extensively used in electronic devices. To enhance the dielectric constant, ceramic fillers with high dielectric constant have been widely introduced into polymer matrices. However, to obtain high permittivity, a large added amount (>50 vol%) is usually needed. With the aim of improving dielectric properties with low filler content, satellite–core-structured Fe₂O₃@BaTiO₃ (Fe₂O₃@BT) nanoparticles were fabricated as fillers for a poly(vinylidene fluoride-co-hexafluoropropylene) (P(VDF-HFP)) matrix. The interfacial polarization effect is increased by Fe₂O₃ nanoparticles, and thus, composite permittivity is enhanced. Besides, the satellite–core structure prevents Fe₂O₃ particles from directly contacting each other, so that the dielectric loss remains relatively low. Typically, with 20 vol% Fe₂O₃@BT nanoparticle fillers, the permittivity of the composite is 31.7 (1 kHz), nearly 1.8 and 3.0 times that of 20 vol% BT composites and pure polymers, respectively. Nanocomposites also achieve high breakdown strength (>150 KV/mm) and low loss tangent (~0.05). Moreover, the composites exhibited excellent flexibility and maintained good dielectric properties after bending. These results demonstrate that composite films possess broad application prospects in flexible electronics.