The electrothermal effect has been investigated extensively in microfluidics since the 1990s and has been suggested as a promising technique for fluid manipulations in lab-on-a-chip devices. The purpose of this article is to provide a timely overview of the previous works conducted in the AC electrothermal field to provide a comprehensive reference for researchers new to this field. First, electrokinetic phenomena are briefly introduced to show where the electrothermal effect stands, comparatively, versus other mechanisms. Then, recent advances in the electrothermal field are reviewed from different aspects and categorized to provide a better insight into the current state of the literature. Results and achievements of different studies are compared, and recommendations are made to help researchers weigh their options and decide on proper configuration and parameters.

The purpose of this work is to demonstrate the fabrication process for cleanroom-free solid metal microneedles and perform quantification of insertion profiles. Metal microneedles were created using a modified wirebonding process and inserted into porcine tissue to determine design efficacy. Microneedle arrays were analyzed through optical imaging and scanning electron microscopy. Insertion forces were measured using combined uniaxial load cell and resistance measurement data. Microneedle arrays were successfully inserted into porcine tissue with high repeatability and reliability. These arrays demonstrate lower or equivalent insertion forces (less than 3 N) to other forms of microneedles in the literature without the need for complex cleanroom fabrication processes. The microneedle fabrication method presented here rapidly produces mass manufacturable, high-quality microneedle arrays with minimal insertion forces, able to reliably penetrate tissue samples. The manufacturing method presented here achieved array densities as high as 3200 needles cm⁻². These microneedle arrays demonstrate simple fabrication of a reliable, high-density, pain-free drug delivery system, with potential applications in biosensing and electric field modulated drug delivery.

Electrothermal micropumps apply an AC electric field to a conductive fluid within the range of 10 kHz–1 MHz to generate fluid flow. In this frequency range, coulombic forces dominate fluid interactions over opposing dielectric forces, resulting in high flow rates (~50–100 μm/s). To date, the electrothermal effect—using asymmetrical electrodes—has been tested only with single-phase and 2-phase actuation, while dielectrophoretic micropumps have shown improved flow rates with 3- and 4-phase actuation. Simulating muti-phase signals in COMSOL Multiphysics requires additional modules and a more involved implementation to accurately represent the electrothermal effect in a micropump. Here, we report detailed simulations of the electrothermal effect under multi-phase conditions, including single-phase, 2-phase, 3-phase and 4-phase actuation patterns. These computational models indicate that 2-phase actuation leads to the highest flow rate, with 3-phase resulting in a 5% reduced flow rate and 4-phase resulting in an 11% reduced flow rate compared to 2-phase. With these modifications to the simulation, various actuation patterns can later be tested in COMSOL for a range of electrokinetic techniques.

Microneedles are a promising technology for pain-free and efficient pharmaceutical delivery. However, their clinical translation is currently limited by the absence of standardized testing methods for critical quality attributes (CQAs), such as mechanical robustness, which are essential for demonstrating safety and efficacy during regulatory review. A key aspect of mechanical robustness is transverse load capacity, which is currently assessed using diverse, non-standardized methods, which have limited capability to measure transverse failure forces at different heights along a microneedle. This is critical for understanding mechanics of potential failure modes during insertion after skin penetration. In this work we utilize a wire bond shear tester, a piece of test equipment widely used in the semiconductor industry, to measure the transverse load capacities of various microneedle designs. This approach is compatible with diverse microneedle types, geometries, and materials, and offers high-throughput and automated testing capabilities with high precision. We measure transverse failure loads with micron-scale control over the test height and have established comprehensive profiles of mechanical robustness along the length of different microneedle designs, which is a capability not previously demonstrated in literature for polymeric and metal microneedles. Transverse failure forces were 10 ± 0.3 gf–128 ± 12 gf for wire bonded gold and silver microneedles, 11 ± 0.7 gf–480 ± 69 gf for conical and pyramidal polymeric microneedles, and 206 ± 80 gf–381 ± 1 gf for 3D printed conical stainless steel microneedles. Additionally, we present standardized definitions for microneedle structural failure modes resulting from transverse loads, which can facilitate root cause failure analysis and defect detection during design and manufacturing, and aid in risk assessment of microneedle products. This work establishes a standardized approach to evaluating a significant CQA of microneedle products, which is a critical step towards expediting their clinical adoption.