The effect of the wet-cleaning process using solvents and detergent on the surface chemistry of MgO(001) substrate for film deposition was investigated. Six different wet-cleaning processes using solvent and detergent were compared. The effect on film growth was studied by the example system ScN. The surface chemistry of the cleaned surface was studied by x-ray photoelectron spectroscopy and the film/substrate interface after film growth was investigated by time-of-flight secondary ion mass spectroscopy. The surface composition is dependent on the wet-cleaning process. Sonication in a detergent before the solvents yield a pure oxide surface compared to hydroxide/carbonate contaminated surface for all the other processes. An annealing step is efficient for the removal of carbon contamination as well as most of the hydroxide or carbonates. The study of the film/substrate interface revealed that the wet-cleaning process significantly affects the final interface and film quality. The substrate cleaned with detergent followed by solvent cleaning exhibited the cleanest surface of the substrate before annealing, after annealing, in addition to the sharpest film/substrate interface.

ScN is an emerging semiconductor with an indirect bandgap. It has attracted attention for its thermoelectric properties, use as seed layers, and for alloys for piezoelectric application. ScN and other transition metal nitride semiconductors used for their interesting electrical properties are sensitive to contaminants, such as oxygen or fluorine. In this present article, the influence of depositions conditions on the amount of oxygen contaminants incorporated in ScN films were investigated and their effects on the electrical properties (electrical resistivity and Seebeck coefficient) were studied. Epitaxial-like films of thickness 125 ± 5 nm to 155 ± 5 nm were deposited by DC-magnetron sputtering on c-plane Al 2 O 3 , MgO(1 1 1) and r-plane Al 2 O 3 at substrate temperatures ranging from 700 °C to 950 °C. The amount of oxygen contaminants in the film, dissolved into ScN or as an oxide, was related to the adatom mobility during growth, which is affected by the deposition temperature and the presence of twin domain growth. The lowest values of electrical resistivity of 50 µΩ cm were obtained on ScN(1 1 1)/ MgO(1 1 1) and on ScN(0 0 1)/r-plane Al 2 O 3 grown at 950 °C with no twin domains and the lowest amount of oxygen contaminant. At the best, the films exhibited an electrical resistivity of 50 µΩ cm with Seebeck coefficient values maintained at-40 µV K-1 , thus a power factor estimated at 3.2 × 10-3 W m-1 K-2 (at room temperature).

For applications in energy harvesting and environmentally friendly cooling, and for power sources in remote or portable applications, it is desired to enhance the efficiency of thermoelectric materials. One strategy consists of reducing the thermal conductivity while increasing or retaining the thermoelectric power factor. An approach to achieve this is doping to enhance the Seebeck coefficient and electrical conductivity, while simultaneously introducing defects in the materials to increase phonon scattering. Here, we use Mg ion implantation to induce defects in epitaxial ScN (111) films. The films were implanted with $\mathrm{M}{\mathrm{g}}^{+}$ ions with different concentration profiles along the thickness of the film, incorporating 0.35 to 2.2 at. % of Mg in ScN. Implantation at high temperature (600 °C), with few defects due to the temperature, does not substantially affect the thermal conductivity compared to a reference ScN. Samples implanted at room temperature, in contrast, exhibited a reduction of the thermal conductivity by a factor of 3. The sample doped with 2.2 at. % of Mg also showed an increased power factor after implantation. This paper thus shows the effect of ion-induced defects on thermal conductivity of ScN films. High-temperature implantation allows the defects to be annealed out during implantation, while the defects are retained for room-temperature implanted samples, allowing for a drastic reduction in thermal conductivity.