An electric-field-driven (EFD), μ-3D printed, fused polymer technique has been developed for the fabrication of large-area microscale prototype molds using typical polymer materials, including microcrystalline wax (MC-wax), polycaprolactone (PCL), and polymathic methacrylate (PMMA). This work proposes an alternative for large area microscale modes and overcomes the limitation of high cost in the traditional mold manufacturing industry. The EFD principle enables printing of fused polymers materials more than one order of magnitude lower than the nozzle diameter, contributing to the necking effect of the Taylor cone jet, which is the key factor to achieve the microscale manufacturing. Numerical simulation of electric field distribution between the meniscus and substrate was carried out to elucidate the dependence of electric field distribution on the meniscus condition of three types of polymers under printable voltage, and the electrical field parameters for the EFD μ-3D printing were determined. A number of experiments were printed successfully using a large range of viscosity materials, ranging from tens of mPa·s to hundreds of thousands of mPa·s of PCL and PMMA. The differences in parameters of different materials, such as viscosity, tensile properties, and surface energy, were studied to assess their use in different fields. Using proper process parameters and a nozzle with an inner diameter of 200 μm, three different application cases were completed, including a Wax microarray and microchannel with a minimum dot diameter of 20 μm, a PCL mesh structure with a minimum line width of 5 μm, and a PMMA large-area mold with a maximum aspect ratio of 0.8. Results show that the EFD μ-3D printing has the outstanding advantages of high printing resolution and polymer material universality.

An additive manufacturing (AM) method for the deposition of metallic layer in micron scale on monocrystalline silicon wafer surface by high voltage induced weak electric arc machining (HV-μEAM) has been proposed. The process characteristics of HV-μEAM are analyzed to fulfil the metal material deposition. The influence of the processing parameters on the deposition effect were studied with copper as additive electrode material. Using the optimal parameters, a number of complex trajectory deposition experiments have been carried out and a QD character-type deposition layer with a height of 139.09 μm has been obtained. The deposition has good continuity and high forming precision. It is proven that the new method is achievable and efficient for patterning metallic materials in the micro- and nano-scale on the silicon substrates surface.