This paper presents a neural network-based digital calibration algorithm for high-speed and time-interleaved (TI) ADCs. In contrast with prior methods, the proposed work features joint amplitude-dependent and phase-dependent nonlinear distortion correction without prior-knowledge of ADC architecture feature. A dynamic calibration is first used to compensate for phase-dependent distortion. Two training optimizations, including a sub-range-sample-based batch schemes and a recursive foreground co-calibration flow are proposed to reduce the error and overfitting and further save hardware resources. A practical calibration engine is also investigated for interleaved ADCs with distributed weight and shared weight methods. To demonstrate the effectiveness of the method, the calibration engine is verified by two fabricated ADC prototypes, a 5 GS/s 16-way interleaved ADC and a 625 MS/s interleaving-SAR assisted pipeline ADC. Measurement results show that SFDR is improved between 16.9dB and 36.4dB before and after calibration for different frequency inputs. To trade-off between accuracy and power consumption, a quantized and pruned engine is implemented on both FPGA and 28nm CMOS technology. Experimental results show that the dedicated calibration on silicon consumes 8.64mW with 0.9V power supply at 333MHz clock rate. Measurement results show that the quantized hardware implementation has only 0.4-4 dB loss in SFDR.

This paper presents a high-gain D-band power amplifier (PA) fabricated with 28-nm CMOS technology for a sub-terahertz frequency modulated continuous wave imaging system. It adopts two-channel power combining using artificial transmission lines to absorb the parasitic capacitance of the ground-signal-ground pad. The layout of the transistors and neutralization capacitors are optimized to improve the maximum stable gain, stability, and robustness. Asymmetrically magnetically coupled resonators are used in inter-stage and input matching networks to extend the operating bandwidth. The PA achieves a peak power gain of 21.9 dB and maximum output power of 11.8 dBm with 10.7% of power-added efficiency. Also, this PA can achieve higher than 10 dBm output power over the frequency range of 120-150 GHz.

This paper presents three-dimensional (3D) models of high-frequency piezoelectric micromachined ultrasonic transducers (PMUTs) based on the finite element method (FEM). These models are verified with fabricated aluminum nitride (AlN)-based PMUT arrays. The 3D numerical model consists of a sandwiched piezoelectric structure, a silicon passive layer, and a silicon substrate with a cavity. Two types of parameters are simulated with periodic boundary conditions: (1) the resonant frequencies and mode shapes of PMUT, and (2) the electrical impedance and acoustic field of PMUT loaded with air and water. The resonant frequencies and mode shapes of an electrically connected PMUT array are obtained with a laser Doppler vibrometer (LDV). The first resonant frequency difference between 3D FEM simulation and the measurement for a 16-MHz PMUT is reasonably within 6%, which is just one-third of that between the analytical method and the measurement. The electrical impedance of the PMUT array measured in air and water is consistent with the simulation results. The 3D model is suitable for predicting electrical and acoustic performance and, thus, optimizing the structure of high-frequency PMUTs. It also has good potential to analyze the transmission and reception performances of a PMUT array for future compact ultrasonic systems.

Piezoelectric micromachined ultrasonic transducers (PMUT) are promising elements to fabricate a two-dimensional (2D) array with a pitch small enough (approximately half wavelength) to form and receive arbitrary acoustic beams for medical imaging. However, PMUT arrays have so far failed to combine the wide, high-frequency bandwidth needed to achieve a high axial resolution. In this paper, a polydimethylsiloxane (PDMS) backing structure is introduced into the PMUTs to improve the device bandwidth while keeping a sub-wavelength (λ) pitch. We implement this backing on a 16 × 8 array with 75 µm pitch (3λ/4) with a 15 MHz working frequency. Adding the backing nearly doubles the bandwidth to 92% (−6 dB) and has little influence on the impulse response sensitivity. By widening the transducer bandwidth, this backing may enable using PMUT ultrasonic arrays for high-resolution 3D imaging.

This article presents a high-power wideband power amplifier (PA) with a four-way power-combining technique for $D$ -band high-resolution radar. The power combiner is based on a two-section Chebyshev impedance converter to achieve a large bandwidth (BW) and is realized with slow wave coplanar waveguides (S-CPWs) to reduce the insertion loss and chip area. Therefore, our developed technique can provide broadband and low-loss power-combining scheme in a very compact size. A high-power PA with four-way combining has been fabricated in a 28-nm CMOS bulk technology. The unit PA uses low- $k$ transformer-based coupled-resonator networks to realize wideband matching. The measured results of the PA prototype demonstrate the peak gain of 22.6 dB, the saturated output power of 16.2 dBm, and the peak power added efficiency of 8.6% at 135 GHz with a 3-dB BW of 28 GHz from 124 to 152 GHz. Meanwhile, the total area of this PA die is merely 0.66 $\times$ 0.73 mm.