The conduction mechanisms in dielectric films are crucial to the successful applications of dielectric materials. There are two types of conduction mechanisms in dielectric films, that is, electrode-limited conduction mechanism and bulk-limited conduction mechanism. The electrode-limited conduction mechanism depends on the electrical properties at the electrode-dielectric interface. Based on this type of conduction mechanism, the physical properties of the barrier height at the electrode-dielectric interface and the effective mass of the conduction carriers in dielectric films can be extracted. The bulk-limited conduction mechanism depends on the electrical properties of the dielectric itself. According to the analyses of bulk-limited conduction mechanisms, several important physical parameters in the dielectric films can be obtained, including the trap level, the trap spacing, the trap density, the carrier drift mobility, the dielectric relaxation time, and the density of states in the conduction band. In this paper, the analytical methods of conduction mechanisms in dielectric films are discussed in detail.

In this work, bipolar resistive switching characteristics were demonstrated in the Pt/ZnO/Pt structure. Reliability tests show that ac cycling endurance level above 106 can be achieved. However, significant window closure takes place after about 102 dc cycles. Data retention characteristic exhibits no observed degradation after 168 h. Read durability shows stable resistance states after 106 read times. The current transportation in ZnO films is dominated by the hopping conduction and the ohmic conduction in high-resistance and low-resistance states, respectively. Therefore, the electrical parameters of trap energy level, trap spacing, Fermi level, electron mobility, and effective density of states in conduction band in ZnO were identified.

In this work, metal/oxide/metal capacitors were fabricated and investigated using transparent boron doped zinc oxide (ZnO:B) films for resistance switching memory applications. The optical band gap of ZnO:B films was determined to be about 3.26 eV and the average value of transmittance of ZnO:B films was about 91% in the visible light region. Experimental results indicated that the resistance switching in the W/ZnO:B/W structure is nonpolar. The resistance ratio of high resistance state (HRS) to low resistance state (LRS) is about of the order of 10⁵ at room temperature. According to the temperature dependence of current-voltage characteristics, the conduction mechanism in ZnO:B films is dominated by hopping conduction and Ohmic conduction in HRS and LRS, respectively. Therefore, trap spacing (1.2 nm) and trap energy levels in ZnO:B films could be obtained.

A silicon-controlled rectifier (SCR)-incorporated BJT with high holding voltage is developed for electrostatic discharge (ESD) protection in a 0.6 μm high-voltage 10 V process. This device consists simply of a floating P⁺ diffusion incorporated in a parasitic NPN BJT. A robust 6-7 kV ESD threshold and high-latchup-immune holding voltage of 15-18 V can be achieved by layout optimization of the NPN-N⁺ -collector to floating P⁺ -diffusion spacing and the floating P⁺ diffusion width. It can be equivalently regarded as parallel connection of an incorporated PNPN SCR part and an NPN BJT part. The incorporated SCR part is further composed of a parasitic SCR in series with a reverse-biased PN diode formed by the floating P⁺ region and N-well. The further analysis shows that the floating P⁺ diffusion is the key part of this SCR-incorporated BJT. The parasitic reverse-biased PN diode sustains most of the high holding voltage. The parasitic NPN BJT plays a major role in ESD current conduction, while the incorporated SCR in series with the reverse-biased PN diode is the secondary conduction path.

This paper addresses the trap exploration in amorphous boron-doped ZnO (ZnO:B) films using an asymmetric structure of metal-oxide-metal. In this work, the structure of Ni/ZnO:B/TaN is adopted and the ZnO:B film is deposited by RF magnetron sputtering. The as-deposited ZnO:B film is amorphous and becomes polycrystalline when annealing temperature is above 500 °C. According to the analysis of conduction mechanism in the as-deposited ZnO:B devices, Ohmic conduction is obtained at positive bias voltage because of the Ohmic contact at the TaN/ZnO:B interface. Meanwhile, hopping conduction is obtained at negative bias voltage due to the defective traps in ZnO:B in which the trap energy level is lower than the energy barrier at the Ni/ZnO:B interface. In the hopping conduction, the temperature dependence of I-V characteristics reveals that the higher the temperature, the lower the current. This suggests that no single-level traps, but only multiple-level traps, exist in the amorphous ZnO:B films. Accordingly, the trap energy levels (0.46–0.64 eV) and trap spacing (1.1 nm) in these multiple-level traps are extracted.