The growth of global food demand combined with the increased appeal to access different foods from every corner of the globe is forcing the food industry to look for alternative technologies to increase the shelf life. Essential oils (EOs) as naturally occurring functional ingredients have shown great prospects in active food packaging. EOs can inhibit the growth of superficial food pathogens, modify nutritious values without affecting the sensory qualities of food, and prolong the shelf life when used in food packaging as an active ingredient. Since 2016, various reports have demonstrated that combinations of electrospun fibers and encapsulated EOs could offer promising results when used as food packaging. Such electrospun platforms have encapsulated either pure EOs or their complexation with other antibacterial agents to prolong the shelf life of food products through sustained release of active ingredients. This paper presents a comprehensive review of the essential oil-loaded electrospun fibers that have been applied as active food packaging material.

For the first time, the binary components of a self-healing epoxy system was developed comprising of a green acrylated epoxy resin and its thiol-based curing agent encapsulated in a poly (methyl methacrylate) (PMMA) shell by electrospraying technique. The field emission scanning electron microscopy images revealed that the two microcapsules formed were almost spherical with rough and irregular surfaces. The average diameter of microcapsules ranged from 1.165 to 1.418 μ m for the two microcapsules. FTIR spectra and thermal analysis were used to investigate the encapsulation of acrylated epoxy resin and thiol curing agent in PMMA as well as the kinetics of crosslinking reaction between the two components. Based on FTIR spectra, the thiol curing agent was involved in the crosslinking reaction with the epoxy group (810 cm ⁻¹ ) and the C = C segment (1634 and 1613 cm ⁻¹ ) of acrylated epoxy resin. The DSC results indicated an exothermic peak (at 65 °C) proving that this system is efficient in self-healing epoxy resins for coating applications. Furthermore, the ability of epoxy coatings to protect the scratched coating substrate from corrosion media (the healing performance) without microcapsule, with dual microcapsules, single healing agent-containing microcapsule and single curing agent-containing microcapsule were also evaluated using potentiodynamic polarization tests and electrochemical impedance spectroscopy (EIS). The results were in line with the potentiodynamic polarization and the EIS. The highest self-healing efficiency (78%) was obtained for binary capsule concentration of 1%, indicating presence of sufficient amount of material to heal the cracks.

This work focused on obtaining a low-temperature powder coating characterized by self-healing properties. To achieve this, acrylic resin, blocked polyisocyanates (bPICs) with 1,2,4-triazole, and unsaturated commercial resin were used. The synthesis of bPICs with triazole enabled the low-temperature curing and reversible Diels–Alder (DA) reaction at 160 °C. The chemical structure of bPICs was confirmed using ¹H-NMR. The occurrence of the DA and retro-DA (rDA) reactions in the crosslinked polymer, at temperatures of 60–85 °C and 90–130 °C, respectively, was confirmed using Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), and FT-IR spectroscopy. The self-healing properties of the powder coating were examined using polarized optical microscopy. Additionally, the occurrence of the DA and rDA reactions between triazole and unsaturated polyester resin was investigated through repeated self-healing tests.