Advancements in astronomical telescopes and cutting-edge technologies, including deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography, have escalated demands and imposed stringent surface quality requirements on optical system components. Achieving near-ideal optical components requires ultra-smooth surfaces with sub-nanometer roughness, no sub-surface damage, minimal surface defects, low residual stresses, and intact lattice integrity. This necessity has driven the rapid development and diversification of ultra-smooth surface fabrication technologies. This paper summarizes recent advances in ultra-smooth surface processing technologies, categorized by their material removal mechanisms. A subsequent comparative analysis evaluates the roughness and polishing characteristics of ultra-smooth surfaces processed on various materials, including fused silica, monocrystalline silicon, silicon carbide, and sapphire. To maximize each process’s advantages and achieve higher-quality surfaces, the paper discusses tailored processing methods and iterations for different materials. Finally, the paper anticipates future development trends in response to current challenges in ultra-smooth surface processing technology, providing a systematic reference for the study of the production of large-sized freeform surfaces.

In this paper, a dwell time optimization method based on the particle swarm optimization algorithm is proposed according to the pulse iteration principle in order to achieve high-precision magnetorheological finishing of optical components. The dwell time optimization method explores the optimal solution in the solution space by comparing the accuracy value of the final surface with the set value. In this way, the dwell time optimization method was able to achieve global optimization of the overall dwell times and each dwell time point, ultimately realizing the high-precision processing of a surface. Through the simulation of two Φ156 mm asphaltic mirrors (1^# and 2^#), the root-mean-square (RMS) and peak–valley (PV) values of 1^# converged from the initial values of 169.164 nm and 1161.69 nm to 24.79 nm and 911.53 nm. Similarly, the RMS and PV values of 2^# converged from the initial values of 187.27 nm and 1694.05 nm to 31.76 nm and 1045.61 nm. The simulation results showed that compared with the general pulse iteration method, the proposed algorithm could obtain a more accurate dwell time distribution of each point under the condition of almost the same processing time, subsequently acquiring a better convergence surface and reducing mid-spatial error. Finally, the accuracy of the optimization algorithm was verified through experiments. The experimental results demonstrated that the optimized algorithm could be used to perform high-precision surface machining. Overall, this optimization method provides a solution for dwell time calculation in the process of the magnetorheological finishing of optical components.

Reactive ion etching (RIE) is a promising material removal method for processing membrane diffractive optical elements and fabrication of meter-scale aperture optical substrates because of its high-efficiency parallel processing and low surface damage. However, the non-uniformity of the etching rate in the existing RIE technology will obviously reduce the machining accuracy of diffractive elements, deteriorate the diffraction efficiency and weaken the surface convergence rate of optical substrates. In the etching process of the polyimide (PI) membrane, additional electrodes were introduced for the first time to achieve the modulation of the plasma sheath properties on the same spatial surface, thus changing the etch rate distribution. Using the additional electrode, a periodic profile structure similar to the additional electrode was successfully processed on the surface of a 200-mm diameter PI membrane substrate by a single etching iteration. By combining etching experiments with plasma discharge simulations, it is demonstrated that additional electrodes can affect the material removal distribution, and the reasons for this are analyzed and discussed. This work demonstrates the feasibility of etching rate distribution modulation based on additional electrodes, and lays a foundation for realizing tailored material removal distribution and improving etching uniformity in the future.

Inductively coupled plasma (ICP), a non-contact optical processing method, has been widely used in the preparation of fused quartz. However, the thermal effect during processing inevitably affects the stability of the removal rate, reduces the processing accuracy, and restricts the further development of plasma processing. This paper analyzes the critical temperature that affects the changes in plasma removal depth, establishes a heat transfer model for plasma jet processing through simulations, derives the heat conduction equation during processing, and obtains the critical radius corresponding to the critical temperature related to the processing speed. Additionally, this work analyzes the path temperature of the grating track used in processing and obtains the path temperature variation curve. Based on the critical radius, a staggered grating track was proposed, which verified that this track can effectively control the path temperature, thereby suppressing the error caused by the thermal effect of processing. This study not only helps to gain a deeper understanding of the heat transfer process in plasma machining, but also provides a basis for achieving high-precision plasma machining path optimization schemes.

In the process of plasma figure correction for a quartz sub-mirror, the plasma parallel removal process and ink masking layer are combined for the first time. A universal plasma figure correction method based on multiple distributed material removal functions is demonstrated, and its technological characteristics are analyzed. Through this method, the processing time is independent of the workpiece aperture, which saves time for the material removal function to scan along the trajectory. After seven iterations, the form error of the quartz element is converged from the initial figure error of ~114 nm RMS to a figure error of ~28 nm RMS, which shows the practical potential of the plasma figure correction method based on multiple distributed material removal functions in optical element manufacturing and the possibility of becoming a new stage process in the optical manufacturing chain.

The polymer deposition layer (PDL) formed during inductively coupled plasma (ICP) processing significantly limits the figuring accuracy and surface quality of fused silica optics. This study investigates the formation mechanism, composition, and evolution of the PDL under varying dwell times and proposes an innovative dwell time gradient strategy to suppress roughness deterioration. A significant disparity in hardness and elastic modulus between the deposition layer and the substrate is revealed, explaining its preferential removal and protective buffering effect in computer-controlled optical surfacing (CCOS). A hybrid ICP-CCOS polishing process was developed for processing a ϕ100 mm fused silica mirror. The results show that within 33 min, the surface graphic error RMS was significantly reduced from 58.006 nm to 12.111 nm, and within 90 min, the surface roughness was ultra-precisely reduced from Ra 1.719 nm to Ra 0.151 nm. The average processing efficiency was approximately 0.63 cm²/min. Critically, a damage-free, ultra-smooth surface without subsurface damage (SSD) was successfully achieved. This hybrid process enables the simultaneous optimization of figure accuracy and roughness, eliminating the need for iterative figuring cycles. It provides a novel theoretical framework for high-precision figuring and post-ICP polymer removal, advancing the efficient fabrication of high-performance optics.