Research on solvent-free acrylic pressure-sensitive adhesives (PSAs) has tremendously grown over the last few decades due to the stringent regulations to control volatile organic compound emissions. They are mostly prepared in the presence of photoinitiators using high-energy UV light that causes several issues such as those associated with radiation safety. Herein, for the first time, solvent-free acrylic PSAs were prepared through visible-light-driven photocatalytic free radical polymerization. Importantly, we found that the use of N-vinyl-based monomers noticeably enhances the rate and conversion of polymerizations, thereby eliminating the need for additives (e.g. α-haloester and sacrificial electron donor) that are usually required for photoredox-mediated free radical polymerization, but concurrently needs an additional purification process to remove residues. Combined experiments and quantum chemical calculations suggest that N-vinyl-based monomers facilitate electron transfer between monomers and photocatalysts, which is responsible for the enhanced rate and converison of polymerization. Viscoelasticity, mechanical strength and adhesion performance of acrylic PSAs were well adjusted in a broad range by controlling the monomer composition, suggesting that our new method would replace the existing photoinitiated free radical polymerization.

Owing to their excellent properties, such as transparency, resistance to oxidation, and high adhesivity, acrylic pressure-sensitive adhesives (PSAs) are widely used. Recently, solvent-free acrylic PSAs, which are typically prepared via photopolymerization, have attracted increasing attention because of the current strict environmental regulations. UV light is commonly used as an excitation source for photopolymerization, whereas visible light, which is safer for humans, is rarely utilized. In this study, we prepared solvent-free acrylic PSAs via visible light-driven photoredox-mediated radical polymerization. Three α-haloesters were used as additives to overcome critical shortcomings, such as the previously reported low film curing rate and poor transparency observed during additive-free photocatalytic polymerization. The film curing rate was greatly increased in the presence of α-haloesters, which lowered the photocatalyst loadings and, hence, improved the film transparency. These results confirmed that our method could be widely used to prepare general-purpose solvent-free PSAs—in particular, optically clear adhesives for electronics.

Epoxy resins have found various industrial applications in high-performance thermosetting resins, high-performance composites, electronic-packaging materials, adhesives, protective coatings, etc., due to their outstanding performance, including high toughness, high-temperature performance, chemical and environmental resistance, versatile processability and adhesive properties. However, cured epoxy resins are very brittle, which limits their applications. In this work, we attempted to enhance the toughness of cured epoxy resins by introducing benzene tetracarboxamide polyamine (BTCP), synthesized from pyromellitic dianhydride (PMDA) and diamines in N-methyl-2-pyrrolidone (NMP) solvent. During this reaction, increased viscosity and formation of amic acid could be confirmed. The chemical reactions were monitored and evidenced using ¹H-NMR spectroscopy, FT-IR spectroscopy, water gel-phase chromatography (GPC) analysis, amine value determination and acid value determination. We also studied the effect of additives on thermomechanical properties using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamical mechanical analysis (DMA), thermomechanical analysis (TMA) and by measuring mechanical properties. The BTCP-containing epoxy resin exhibited high mechanical strength and adhesion strength proportional to the amount of BTCP. Furthermore, field-emission scanning electron microscopy images were obtained for examining the cross-sectional morphology changes of the epoxy resin specimens with varying amounts of BTCP.

Epoxy resins are commonly used to manufacture the molding compounds, reinforced plastics, coatings, or adhesives required in various industries. However, the demand for new epoxy resins has increased to satisfy diverse industrial requirements such as enhanced mechanical properties, thermal stability, or electrical properties. Therefore, in this study, we synthesized new epoxy resin (PPME) by modifying phosphorous-containing polyol. The prepared resin was analyzed and added to epoxy compositions in various quantities. The compositions were cured at high temperatures to obtain plastics to further test the mechanical and thermal properties of the epoxy resin. The measured tensile and flexural strength of epoxy compositions were similar to the composition without synthesized epoxy resin. However, the heat release rates of the compositions exhibited tendencies of a decrease proportional to the amount of PPME.

In this study, a phosphorous-containing polyol (P-polyol) was synthesized and reacted with isophorone diisocyanate (IPDI) to produce water-dispersed polyurethane. To synthesize waterborne polyurethanes (WPUs), mixtures of P-polyol and polycarbonate diol (PCD) were reacted with IPDI, followed by the addition of dimethylol propionic acid, to confer hydrophilicity to the produced polyurethane. An excess amount of water was used to disperse polyurethane in water, and the terminal isocyanate groups of the resulting WPUs were capped with ethylene diamine. P-polyol:PCD molar ratios of 0.1:0.9, 0.2:0.8, and 0.3:0.7 were used to synthesize WPUs. The films prepared by casting and drying the synthesized WPUs in plastic Petri dishes were used to test the changes in physical properties induced by changing the P-polyol:PCD molar ratio. The experimental results revealed that the tensile strength of PU-10, the WPU with a P-polyol:PCD molar ratio of 0.1:0.9, was 16% higher than that of the reference P-polyol–free WPU sample. Moreover, the thermal decomposition temperature of PU-10 was 27 °C higher than that of the reference sample.

UV-responsive pressure-sensitive adhesives (PSAs) were achieved through the ring-opening reactions of N -carbonyl aziridine radicals.