This work explores the influence of Hall current on the thermoelastic behavior of nanostructured (nonlocal) plates made of an elastic material, modeled under a double-temperature (two-temperature theory) framework, and subjected to ramp-type heating. The dual-temperature model accounts for the separate thermal dynamics, while the nonlocal elasticity theory incorporates long-range interactions within the material, making it particularly suitable for nanoscale materials. The governing equations are derived by integrating the effects of Hall current, and nonlocal elasticity into the coupled electro-thermo-mechanical equations according to the dual-phase lag model. The solution is obtained through the application of the normal mode analysis technique, allowing for the decoupling of the governing equations into solvable ordinary differential equations. Numerical simulations are performed, and results are presented graphically to compare the wave propagation characteristics of the basic physical fields such as temperature, displacement, acoustic pressure, and stress under the influence of Hall current and varying nonlocal parameters. The results reveal significant changes in wave propagation under varying boundary conditions, offering valuable insights into the interaction between magneto-electric fields, mechanical stresses, and thermal gradients. The study provides a novel framework for understanding wave propagation in nanostructured materials and paves the way for further research into their application in advanced thermoelectric-mechanical devices.

The propagation of plane harmonic waves in a semiconductor photothermal thermoelastic half-space is studied using the Moore–Gipson–Thompson heat conduction model. The medium is characterized by a microelongational structure and is influenced by rotation and gravity. A harmonic wave solution is utilized to derive the qualifier functions of the medium. The results are analyzed and illustrated for various rotation and gravity values. It is observed that both factors significantly affect the plasma effect and other field functions positively. Silicon is selected for the numerical scheme due to its relevance in manufacturing applications. The development of technologies in semiconducting media is widely used in modern engineering, such as smart materials and manufacturing processes.

This study presents a comprehensive investigation into the hygrothermoelastic behavior of orthotropic materials, focusing on the intricate coupling between moisture diffusion, temperature variation, and mechanical stresses. The generalized equations of hygrothermoelasticity are utilized to derive a three-dimensional (3D) model, which is subsequently reduced to a two-dimensional (2D) framework for analyzing plane wave propagation in an elastic medium. The primary physical fields under consideration (elastic displacements, temperature, and moisture diffusion) are coupled through the governing equations and are influenced by mechanical and thermal sources applied at the material’s free surface. Wave solutions are utilized to solve the coupled wave equations that are produced in terms of moisture content, displacement, and temperature. A mechanical and thermal source is applied over the free surface of the hygrothermoelastic media to acquire the components of displacement, stresses, temperature field, and moisture concentration in the medium. These components are then graphically depicted. The results reveal significant insights into the role of moisture content in altering wave propagation characteristics, including changes in wave speed, amplitude, and attenuation. These findings underscore the critical influence of moisture on material properties such as stiffness, strength, and thermal conductivity. Furthermore, the study highlights the interdependence of thermal and mechanical fields, demonstrating the complex interactions between environmental factors and orthotropic material behavior.