Chenyin Feng

Dr. Chenyin Feng

Hubei University, Wuhan, Hubei, China
orcid

Research Focus & Metrics

Academic Career Length

6Years (2021-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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2 January 2025 in Journal of Materials Chemistry C
Verified
Journal Article
Closed access
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XHXuanran Hu
Xuanran Hu
JWJunke Wang
Junke Wang
CFChenyin Feng
Chenyin Feng
JYJun Yuan
Jun Yuan
QWQiangmin Wei
Qiangmin Wei
HWHao Wang
Hao Wang
This paper reviews the research, application and working principle of laser-induced graphene (LIG) in four fields: energy storage devices, mechanical sensors, gas sensors and biosensors.

7 October 2023 in Nanomaterials
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Journal Article
Open access
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CFChenyin Feng
Chenyin Feng
WWWu Wen Wei
Wu Wen Wei
HLHuiDi Liu
HuiDi Liu
JWjunke wang
junke wang
HWHouzhao Wan
Houzhao Wan
HWHao Wang
Hao Wang
Recently, two-dimensional (2D) materials and their heterostructures have been recognized as the foundation for future brain-like neuromorphic computing devices. Two-dimensional materials possess unique characteristics such as near-atomic thickness, dangling-bond-free surfaces, and excellent mechanical properties. These features, which traditional electronic materials cannot achieve, hold great promise for high-performance neuromorphic computing devices with the advantages of high energy efficiency and integration density. This article provides a comprehensive overview of various 2D materials, including graphene, transition metal dichalcogenides (TMDs), hexagonal boron nitride (h-BN), and black phosphorus (BP), for neuromorphic computing applications. The potential of these materials in neuromorphic computing is discussed from the perspectives of material properties, growth methods, and device operation principles.

26 January 2021 in Micromachines
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Journal Article
Open access
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MBMohammad Beygi
Mohammad Beygi
William Dominguez-ViqueiraWilliam Dominguez-Viqueira
William Dominguez-Viqueira
CFChenyin Feng
Chenyin Feng
GMGokhan Mumcu
Gokhan Mumcu
CFChristopher L. Frewin
Christopher L. Frewin
Stephen Edward  SaddowStephen Edward Saddow
Stephen Edward Saddow
An essential method to investigate neuromodulation effects of an invasive neural interface (INI) is magnetic resonance imaging (MRI). Presently, MRI imaging of patients with neural implants is highly restricted in high field MRI (e.g., 3 T and higher) due to patient safety concerns. This results in lower resolution MRI images and, consequently, degrades the efficacy of MRI imaging for diagnostic purposes in these patients. Cubic silicon carbide (3C-SiC) is a biocompatible wide-band-gap semiconductor with a high thermal conductivity and magnetic susceptibility compatible with brain tissue. It also has modifiable electrical conductivity through doping level control. These properties can improve the MRI compliance of 3C-SiC INIs, specifically in high field MRI scanning. In this work, the MRI compliance of epitaxial SiC films grown on various Si wafers, used to implement a monolithic neural implant (all-SiC), was studied. Via finite element method (FEM) and Fourier-based simulations, the specific absorption rate (SAR), induced heating, and image artifacts caused by the portion of the implant within a brain tissue phantom located in a 7 T small animal MRI machine were estimated and measured. The specific goal was to compare implant materials; thus, the effect of leads outside the tissue was not considered. The results of the simulations were validated via phantom experiments in the same 7 T MRI system. The simulation and experimental results revealed that free-standing 3C-SiC films had little to no image artifacts compared to silicon and platinum reference materials inside the MRI at 7 T. In addition, FEM simulations predicted an ~30% SAR reduction for 3C-SiC compared to Pt. These initial simulations and experiments indicate an all-SiC INI may effectively reduce MRI induced heating and image artifacts in high field MRI. In order to evaluate the MRI safety of a closed-loop, fully functional all-SiC INI as per ISO/TS 10974:2018 standard, additional research and development is being conducted and will be reported at a later date.

13 July 2021 in Micromachines
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Journal Article
Open access
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CFChenyin Feng
Chenyin Feng
CFChristopher L. Frewin
Christopher L. Frewin
MTMdRubayat-E Tanjil
MdRubayat-E Tanjil
RERichard Everly
Richard Everly
JBJay Bieber
Jay Bieber
Stephen Edward  SaddowStephen Edward Saddow
Stephen Edward Saddow
Carbon containing materials, such as graphene, carbon-nanotubes (CNT), and graphene oxide, have gained prominence as possible electrodes in implantable neural interfaces due to their excellent conductive properties. While carbon is a promising electrochemical interface, many fabrication processes are difficult to perform, leading to issues with large scale device production and overall repeatability. Here we demonstrate that carbon electrodes and traces constructed from pyrolyzed-photoresist-film (PPF) when combined with amorphous silicon carbide (a-SiC) insulation could be fabricated with repeatable processes which use tools easily available in most semiconductor facilities. Directly forming PPF on a-SiC simplified the fabrication process which eliminates noble metal evaporation/sputtering and lift-off processes on small features. PPF electrodes in oxygenated phosphate buffered solution at pH 7.4 demonstrated excellent electrochemical charge storage capacity (CSC) of 14.16 C/cm2, an impedance of 24.8 ± 0.4 kΩ, and phase angle of −35.9 ± 0.6° at 1 kHz with a 1.9 kµm2 recording site area.

10 September 2025 in ACS Applied Electronic Materials
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Journal Article
Closed access
DLDong Li
Dong Li
DWDaigan Wang
Daigan Wang
YTYe Tao
Ye Tao
SZShaojie Zhang
Shaojie Zhang
GMGuokun Ma
Guokun Ma
HWHao Wang
Hao Wang

15 December 2025 in Nanomaterials
Verified
Journal Article
Open access
PDF file
CFChristopher L. Frewin
Christopher L. Frewin
MMMatthew Melton
Matthew Melton
EBEvans Bernardin
Evans Bernardin
MBMohammad Beygi
Mohammad Beygi
CFChenyin Feng
Chenyin Feng
Stephen Edward  SaddowStephen Edward Saddow
Stephen Edward Saddow
The promise of intracortical neural interfaces—to restore lost sensory and motor function and probe the brain’s activity—has long been constrained by device instability over chronic implantation. Conventional silicon-based probes, composed of heterogeneous materials, often fail due to mechanical mismatch, inflammatory responses, and interface-driven degradation, where stress can induce cracking, swelling, and exposure of cytotoxic elements to neural tissue. Silicon carbide (SiC) offers a compelling solution, combining chemical inertness, structural strength, and biocompatibility in both amorphous and crystalline forms. In this review, we discuss advances in SiC neural interfaces, highlighting contributions from multiple laboratories and emphasizing our own work on monolithic devices, constructed entirely from a single, homogeneous SiC material system. These devices mitigate interface-driven failures and show preliminary indications of magnetic resonance imaging (MRI) compatibility, with minimal image artifacts observed compared to conventional silicon probes, though further in vivo studies are needed to confirm thermal safety at high-field conditions. Collectively, SiC establishes a versatile platform for next-generation, durable neural interfaces capable of reliable, long-term brain interaction for both scientific and clinical applications.