Metal deterioration via corrosion is a ubiquitous and persistent problem. Ångström-scale, atomically thin 2D materials are promising candidates for effective, robust, and economical corrosion passivation coatings due to their ultimate thinness and excellent mechanical and electrical properties. This review focuses on elucidating the mechanism of 2D materials in corrosion mitigation and passivation related to their physicochemical properties and variations, such as defects, out-of-plane deformations, interfacial states, temporal and thickness variations, etc. In addition, this review discusses recent progress and developments of 2D material coatings for corrosion mitigation and passivation as well as the significant challenges to overcome in the future.

Carbon containing materials, such as graphene, carbon-nanotubes (CNT), and graphene oxide, have gained prominence as possible electrodes in implantable neural interfaces due to their excellent conductive properties. While carbon is a promising electrochemical interface, many fabrication processes are difficult to perform, leading to issues with large scale device production and overall repeatability. Here we demonstrate that carbon electrodes and traces constructed from pyrolyzed-photoresist-film (PPF) when combined with amorphous silicon carbide (a-SiC) insulation could be fabricated with repeatable processes which use tools easily available in most semiconductor facilities. Directly forming PPF on a-SiC simplified the fabrication process which eliminates noble metal evaporation/sputtering and lift-off processes on small features. PPF electrodes in oxygenated phosphate buffered solution at pH 7.4 demonstrated excellent electrochemical charge storage capacity (CSC) of 14.16 C/cm², an impedance of 24.8 ± 0.4 kΩ, and phase angle of −35.9 ± 0.6° at 1 kHz with a 1.9 kµm² recording site area.

Goldbeating is the ancient craft of thinning bulk gold (Au) into gossamer leaves. Pioneered by ancient Egyptian craftsmen, modern mechanized iterations of this technique can fabricate sheets as thin as ∼100 nm. We take inspiration from this millennia-old craft and adapt it to the nanoscale regime, using colloidally synthesized 0D/1D Au nanoparticles (AuNPs) as highly ductile and malleable nanoscopic Au ingots and subjecting them to solid-state, uniaxial compression. The applied stress induces anisotropic morphological transformation of AuNPs into 2D leaf form and elucidates insights into metal nanocrystal deformation at the extreme length scales. The induced 2D morphology is found to be dependent on the precursor 0D/1D NP morphology, size (0D nanosphere diameter and 1D nanorod diameter and length), and their on-substrate arrangement (e.g., interparticle separation and packing order) prior to compression. Overall, this versatile and generalizable solid-state compression technique enables new pathways to synthesize and investigate the anisotropic morphological transformation of arbitrary NPs and their resultant emergent phenomena.

Ångström-thin hexagonal boron nitride (hBN) is a highly promising barrier/liner dielectric material for passivating electrical interconnects in ultra-scaled integrated circuits (ICs). In article number 2100002, Michael Cai Wang and co-workers present a novel approach to mitigating electromigration in nanoscale copper interconnects. Significant improvements in the breakdown current density and operating lifetime are observed in hBN-passivated copper interconnects, paving the way for further single-nanometer node scaling of semiconductor and ICs manufacturing