Martin Gotterbarm

Mr. Martin Gotterbarm

Friedrich-Alexander Universität Erlangen-Nürnberg

Research Focus & Metrics

Academic Career Length

8Years (2019-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

View All Publications
28 February 2020 in Metals
Verified
Journal Article
Open access
PDF file
MGMartin Gotterbarm
Martin Gotterbarm
Alexander RauschAlexander Rausch
Alexander Rausch
Carolin KoernerCarolin Koerner
Carolin Koerner
Selective Electron Beam Melting (SEBM) is a powder bed-based additive manufacturing process for metals. As the electron beam can be moved inertia-free by electromagnetic lenses, the solidification conditions can be deliberately adjusted within the process. This enables control over the local solidification conditions. SEBM typically leads to columnar grain structures. Based on numerical simulation, we demonstrated how technical single crystals develop in IN718 by forcing the temperature gradient along a µ-Helix. The slope of the µ-Helix, i.e., the deviation of the thermal gradient from the build direction, determined the effectiveness of grain selection right up to single crystals.

23 December 2019 in Materials
Verified
Journal Article
Open access
PDF file
MRMichael Rasch
Michael Rasch
JHJohannes Heberle
Johannes Heberle
MDMaximilian Dechet
Maximilian Dechet
DBDominic Bartels
Dominic Bartels
MGMartin Gotterbarm
Martin Gotterbarm
MSMichael Schmidt
Michael Schmidt
Powder Bed Fusion with Laser Beam of Metals (PBF-LB/M) is one of the fastest growing technology branches. More and more metallic alloys are being qualified, but processing of aluminum wrought alloys without cracks and defects is still challenging. It has already been shown that small parts with low residual porosity can be produced. However, suffering from microscopic hot cracks, the fracture behavior has been rather brittle. In this paper different combinations of temperature gradients and solidification rates are used to achieve specific solidification conditions in order to influence the resulting microstructure, as well as internal stresses. By this approach it could be shown that EN AW-2024, an aluminum-copper wrought alloy, is processable via PBF-LB/M fully dense and crack-free with outstanding material properties, exceeding those reported for commonly manufactured EN AW-2024 after T4 heat treatment.

3 December 2020 in Materials
Verified
Journal Article
Open access
PDF file
Alexander RauschAlexander Rausch
Alexander Rausch
MGMartin Gotterbarm
Martin Gotterbarm
JPJulian Pistor
Julian Pistor
Matthias MarklMatthias Markl
Matthias Markl
Carolin KoernerCarolin Koerner
Carolin Koerner
A microstructure has significant influence on the mechanical properties of parts. For isotropic properties, the formation of equiaxed microstructures by the nucleation of new grains during solidification is necessary. For conventional solidification processes, nucleation is well-understood. Regarding powder bed fusion, the repeated remelting of previous layers can cause nucleation under some conditions that are not explainable with classical theories. Here, we investigate this nucleation mechanism with an unprecedented level of detail. In the first step, we built samples with single crystalline microstructures from Ni-base superalloy IN718 by selective electron beam melting. In the second step, single lines with different parameters were molten on top of these samples. We observed a huge number of new grains by nucleation at the melt-pool border of these single lines. However, new grains can only prevail if the alignment of their crystallographic orientation with respect to the local temperature gradient is superior to that of the base material. The current hypothesis is that nucleation at the melt-pool border happens due to remelting microsegregations from former solidification processes leading to constitutional undercooling directly at the onset of solidification. This study offers the opportunity to understand and exploit this mechanism for different manufacturing processes.