Through-silicon via (TSV) is an important component for implementing 3-D packages and 3-D integrated circuits as the TSV technology allows stacked silicon chips to interconnect through direct contact to help facilitate high-speed signal processing. By facilitating the stacking of silicon chips, the TSV technology also helps to meet the increasing demand for high density and high performance miniaturized electronic products. Our review of the literature shows that very few studies have reported on the impact of TSV bump geometry on the electrical and mechanical characteristics of the TSV. This paper reports on the investigation of different TSV geometries with the focus on identifying the ideal shapes for improved electrical signal transmission as well as for improved mechanical reliability. The cylindrical, quadrangular (square), elliptical, and triangular shapes were investigated in our study and our results showed that the quadrangular shape had the best electrical performance due to good characteristic impedance. Our results also showed that the quadrangular and cylindrical shapes provided improved mechanical reliability as these two shapes lead to high Cu protrusion of TSV after the annealing process.

Achieving the global electricity demand and meeting the United Nations sustainable development target on reliable and sustainable energy supply by 2050 are crucial. Portable energy storage (PES) units, powered by solid-state battery cells, can offer a sustainable and cost-effective solution for regions with limited power-grid access. However, operating in high-dust and high-temperature environments presents challenges that require effective thermal management solutions. This paper is a comprehensive review of thermal management systems for PES units, with a specific focus on addressing the challenge of overheating in airtight designs. The review of various active and passive cooling systems is conducted through extensive study of the relevant literature, which is significant in providing insights into the operation, performance parameters, and design options for different cooling system technologies. The findings from this review show heat pipe (HP) technologies as key cooling-system solutions for airtight PES units. Specifically, loop and oscillating HPs, as well as the vapour chamber, offer desirable features such as compactness, low cost, and high thermal conductivity that make them superior to other alternatives for the cooling systems in PES. The insights and knowledge generated via this review will help facilitate the design and development of innovative, efficient, and reliable PES units, thereby contributing to the advancement of off-grid renewable energy applications and enabling sustainable power solutions worldwide. Furthermore, an appropriate design of PES units can help in reducing capital and maintenance costs.

Numerical results for simply supported rectangular steel plates subjected to blast loading are presented. The effects of geometric and material non-linearities are considered. Finite element analysis with ABAQUS software is used to determine the deformation of corroded plates subjected to blast loads. The results for the cases of triangular pulse pressure representative of gas explosion overpressure on unstiffened plates are validated using published data. Thorough parametric studies are performed to study the effects of influential parameters, including aspect ratio of plates, degree of pitting and corrosion patterns. The results show that a reduction in the dynamic load carrying capacity of 8% can occur due to corrosion in plates with 50% degree of pitting. Also it is shown that the mid-point deflection increases with an increase in the applied impulse, and degree of pitting, however, decreases with increasing plate aspect ratio. Corrosion pattern has significant effect on reduction of load carrying capacity. Maximum reduction occurs when pits are concentrated at the centre of plate. The region between core diameter and the edges of the plate is less dangerous.