2D transition‐metal carbides and nitrides, known as MXenes, have displayed promising properties in numerous applications, such as energy storage, electromagnetic interference shielding, and catalysis. Titanium carbide MXene (Ti₃C₂T_x), in particular, has shown significant energy‐storage capability. However, previously, only micrometer‐thick, nontransparent films were studied. Here, highly transparent and conductive Ti₃C₂T_x films and their application as transparent, solid‐state supercapacitors are reported. Transparent films are fabricated via spin‐casting of Ti₃C₂T_x nanosheet colloidal solutions, followed by vacuum annealing at 200 °C. Films with transmittance of 93% (≈4 nm) and 29% (≈88 nm) demonstrate DC conductivity of ≈5736 and ≈9880 S cm⁻¹, respectively. Such highly transparent, conductive Ti₃C₂T_x films display impressive volumetric capacitance (676 F cm⁻³) combined with fast response. Transparent solid‐state, asymmetric supercapacitors (72% transmittance) based on Ti₃C₂T_x and single‐walled carbon nanotube (SWCNT) films are also fabricated. These electrodes exhibit high capacitance (1.6 mF cm⁻²) and energy density (0.05 µW h cm⁻²), and long lifetime (no capacitance decay over 20 000 cycles), exceeding that of graphene or SWCNT‐based transparent supercapacitor devices. Collectively, the Ti₃C₂T_x films are among the state‐of‐the‐art for future transparent, conductive, capacitive electrodes, and translate into technologically viable devices for next‐generation wearable, portable electronics.

This review comprehensively summarizes the progress on the structural and electronic modulation of transition metal nitrides for electrochemical energy applications.

Direct printing of functional inks is critical for applications in diverse areas including electrochemical energy storage, smart electronics and healthcare. However, the available printable ink formulations are far from ideal. Either surfactants/additives are typically involved or the ink concentration is low, which add complexity to the manufacturing and compromises the printing resolution. Here, we demonstrate two types of two-dimensional titanium carbide (Ti₃C₂T_x) MXene inks, aqueous and organic in the absence of any additive or binary-solvent systems, for extrusion printing and inkjet printing, respectively. We show examples of all-MXene-printed structures, such as micro-supercapacitors, conductive tracks and ohmic resistors on untreated plastic and paper substrates, with high printing resolution and spatial uniformity. The volumetric capacitance and energy density of the all-MXene-printed micro-supercapacitors are orders of magnitude greater than existing inkjet/extrusion-printed active materials. The versatile direct-ink-printing technique highlights the promise of additive-free MXene inks for scalable fabrication of easy-to-integrate components of printable electronics.

The fast growth of portable smart electronics and internet of things have greatly stimulated the demand for miniaturized energy storage devices. Micro‐supercapacitors (MSCs), which can provide high power density and a long lifetime, are ideal stand‐alone power sources for smart microelectronics. However, relatively few MSCs exhibit both high areal and volumetric capacitance. Here rapid production of flexible MSCs is demonstrated through a scalable, low‐cost stamping strategy. Combining 3D‐printed stamps with arbitrary shapes and 2D titanium carbide or carbonitride inks (Ti₃C₂T_x and Ti₃CNT_x, respectively, known as MXenes), flexible all‐MXene MSCs with controlled architectures are produced. The interdigitated Ti₃C₂T_x MSC exhibits high areal capacitance: 61 mF cm⁻² at 25 µA cm⁻² and 50 mF cm⁻² as the current density increases by 32 fold. The Ti₃C₂T_x MSCs also showcase capacitive charge storage properties, good cycling lifetime, high energy and power densities, etc. The production of such high‐performance Ti₃C₂T_x MSCs can be easily scaled up by designing pad or cylindrical stamps, followed by a cold rolling process. Collectively, the rapid, efficient production of flexible all‐MXene MSCs with state‐of‐the‐art performance opens new exciting opportunities for future applications in wearable and portable electronics.