Katsuyuki Sakuma is a principal research scientist, manager, and IBM master inventor at the IBM Thomas J. Watson Research Center. He is currently a visiting professor at the Department of Biomedical Engineering, Tohoku University in Japan, and was previously a visiting professor at National Chiao Tung University in Taiwan. His research interests include 3D integration technologies, advanced packaging, and biomedical engineering. He has published more than 100 peer-reviewed journal papers and conference proceedings papers, including five book chapters. He also holds more than 95 issued or pending U.S. and international patents. He has been recognized with the IBM 20th Invention Achievement Award in 2022 and an Outstanding Technical Achievement Award (OTAA) in 2015. He was also given the 2018 Exceptional Technical Achievement Award from IEEE Electronics Packaging Society and the 2017 Alumni Achievement Award from his alma mater, the School of Engineering at Tohoku University. He was co-recipient of IEEE CPMT Japan Society Best Presentation Award in 2012 and the IMAPS Best Paper Award of the interactive poster session in 2015. He received his B.S. and M.S. degrees from Tohoku University, respectively, and his Ph.D. degree from Waseda University, Japan. He has served as a committee member of the IEEE ECTC subcommittee since 2012 and for the IEEE 3DIC technical program committee since 2016.