Roll-to-roll UV nanoimprint lithography has superior advantages for high-throughput manufacturing of micro- or nano-structures on flexible polymer foils with various geometries and configurations. Our pilot line provides large-scale structure imprinting for cost-effective polymer biochips (4500 biochips/hour), enabling rapid and multiplexed detections. A complete high-volume process chain of the technology for producing structures like μ-sized, triangular optical out-couplers or capillary channels (width: from 1 μm to 2 mm, height: from 200 nm up to 100 μm) to obtain biochips (width: 25 mm, length: 75 mm, height: 100 μm to 1.5 mm) was described. The imprinting process was performed with custom-developed resins on polymer foils with resin thicknesses ranging between 125–190 μm. The produced chips were tested in a commercial point-of-care diagnostic system for multiplexed DNA analysis of methicillin resistant Staphylococcus aureus (e.g., mecA, mecC gene detections). Specific target DNA capturing was based on hybridisation between surface bound DNA probes and biotinylated targets from the sample. The immobilised biotinylated targets subsequently bind streptavidin–horseradish peroxidase conjugates, which in turn generate light upon incubation with a chemiluminescent substrate. To enhance the light out-coupling thus to improve the system performance, optical structures were integrated into the design. The limits-of-detection of mecA (25 bp) for chips with and without structures were calculated as 0.06 and 0.07 μM, respectively. Further, foil-based chips with fluidic channels were DNA functionalised in our roll-to-roll micro-array spotter following the imprinting. This straightforward approach of sequential imprinting and multiplexed DNA functionalisation on a single foil was also realised for the first time. The corresponding foil-based chips were able to detect mecA gene DNA sequences down to a 0.25 μM concentration.

The nanoimprint replication of biomimetic nanostructures can be interesting for a wide range of applications. We demonstrate the process chain for Morpho-blue-inspired nanostructures, which are especially challenging for the nanoimprint process, since they consist of multilayer undercut structures, which typically cannot be replicated using nanoimprint lithography. To achieve this, we used a specially made, proprietary imprint material to firstly allow successful stamp fabrication from an undercut master structure, and secondly to enable UV-based nanoimprinting using the same material. Nanoimprinting was performed on polymer substrates with stamps on polymer backplanes to be compatible with roller-based imprinting processes. We started with single layer undercut structures to finally show that it is possible to successfully replicate a multilayer undercut stamp from a multilayer undercut master and use this stamp to obtain multilayer undercut nanoimprinted samples.

A high throughput manufacturing process of microfluidic chips based on Roll-to-Roll imprinting is presented. With this procedure, microfluidic patterns can be produced on large area polymer substrates. The subsequent steps of inlet drilling, bonding and electrode printing are set-up on large area processes, too. Overall, this strategy allows highly parallelized processing of large numbers of chips—all costly steps of individual chip handling are avoided. The chips were used for the characterization of inorganic ions for soil nutrient analysis.

We report on our development strategy of photo-curable resists for nanoimprint lithography (NIL) based on modularity. Starting with a basic formulation, we address two topics: the integration of fluorinated additives and the enhancement of the dry etching stability. We prove both concepts by the introduction of two different resists derived from the same basic formulation. The viscosity of the novel resist materials was optimized for inkjet dispensing at room temperature (RT). The novel resist materials can be applied either in NIL batch processes or in high-throughput roller processes. Batch-wise imprints were performed on various substrates such as Si or plastics, demonstrating the distinctive application versatility of the novel materials. Dry etching of spin-coated thin films on Si wafers was performed, demonstrating an etch stability versus Si of 3.5:1 by using the resist formulation with improved etching stability. Roll-to-roll NIL at high throughput on large areas was performed with web speeds of up to $30mmin−1$ with different stamp materials. We conclude that all resists reported herein can be deposited via inkjet dispensing at RT, are suitable for continuous high-throughput imprinting on flexible substrates, and are applicable in step-wise NIL processes with good etch resistance in dry etch processes.