Manuel Reis Carneiro

Dr. Manuel Reis Carneiro

orcid

Research Focus & Metrics

Academic Career Length

7Years (2020-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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9 March 2023 in Nature Electronics
Verified
Journal Article
Closed access
PDF file
YZYongyi Zhao
Yongyi Zhao
YOYunsik Ohm
Yunsik Ohm
JLJiahe Liao
Jiahe Liao
YLYichi Luo
Yichi Luo
HCHuai-Yu Cheng
Huai-Yu Cheng
CMCarmel Majidi
Carmel Majidi

27 June 2022 in Advanced Materials
Verified
Journal Article
Open access
MTMahmoud Tavakoli
Mahmoud Tavakoli
PLPedro Alhais Lopes
Pedro Alhais Lopes
AHAbdollah Hajalilou
Abdollah Hajalilou
ASAndré F. Silva
André F. Silva
Manuel Reis CarneiroManuel Reis Carneiro
Manuel Reis Carneiro
AAAníbal T. de Almeida
Aníbal T. de Almeida
E‐waste is rapidly turning into another man‐made disaster. It is proposed that a paradigm shift toward a more sustainable future can be made through soft‐matter electronics that are resilient, repairable if damaged, and recyclable (3R), provided that they achieve the same level of maturity as industrial electronics. This includes high‐resolution patterning, multilayer implementation, microchip integration, and automated fabrication. Herein, a novel architecture of materials and methods for microchip‐integrated condensed soft‐matter 3R electronics is demonstrated. The 3R function is enabled by a biphasic liquid metal‐based composite, a block copolymer with nonpermanent physical crosslinks, and an electrochemical technique for material recycling. In addition, an autonomous laser‐patterning method for scalable circuit patterning with an exceptional resolution of <30 µm in seconds is developed. The phase‐shifting property of the BCPs is utilized for vapor‐assisted “soldering” circuit repairing and recycling. The process is performed entirely at room temperature, thereby opening the door for a wide range of heat‐sensitive and biodegradable polymers for the next generation of green electronics. The implementation and recycling of sophisticated skin‐mounted patches with embedded sensors, electrodes, antennas, and microchips that build a digital fingerprint of the human electrophysiological signals is demonstrated by collecting mechanical, electrical, optical, and thermal data from the epidermis.

16 July 2020 in IEEE Sensors Journal
Verified
Journal Article
Closed access
Manuel Reis CarneiroManuel Reis Carneiro
Manuel Reis Carneiro
Anibal T. de AlmeidaAnibal T. de Almeida
Anibal T. de Almeida
MTMahmoud Tavakoli
Mahmoud Tavakoli
Electroencephalography (EEG) has a wide range of applications in medical diagnosis, and novel form of Human Machine Interfaces (HMI) for controlling prosthetic implants, wheelchairs, and home appliances in various forms of paralysis. However, the current EEG setups are composed of many wires hanging down from the system, and individual electrodes that must be set manually, which is time-consuming. As a result, the overall system is neither comfortable, nor aesthetically appealing. Here, we introduce for the first time, a comfortable textile-based EEG headband system that is soft, conformal to the skin, and comfortable. We present materials and methods for fabrication of multi-layer stretchable e-textile, that interfaces the human epidermis from one side through printed electrodes, and interfaces a rigid PCB island on the second layer. We as well demonstrate a method that allows creation of VIAs (vertical interconnect access) between the layers, using a CO2 laser. All Electrodes are integrated into the headband, and thus there is no need for individual electrode placement, and individual wiring. By screen printing a home-made conductive stretchable ink, patient-specific EEG headbands can be tailor made considering the optimal positioning of the electrodes for each patient. We show that these printed electrodes benefit from a very low skin-electrode impedance, comparable to gold standard Ag/AgCl, or gold cup electrodes, thanks to the high surface area silver flakes used in this work. The e-textile headband interfaces with an EEG acquisition device that captures, amplifies, and transmits the data to an external mobile phone or a PC. Furthermore, the integrated amplification in the textile and the use of an EMF rejection layer on top of the electrodes were shown to reduce the unwanted EM noise that is picked up by the system. We as well show application of the developed headband for usage in Human Machine Interfaces and Sleep Data Acquisition. Altogether, this device is step toward wider use of EEG acquisition devices for daily-use applications.

23 August 2022 in Advanced Functional Materials
Verified
Journal Article
Open access
Manuel Reis CarneiroManuel Reis Carneiro
Manuel Reis Carneiro
CMCarmel Majidi
Carmel Majidi
MTMahmoud Tavakoli
Mahmoud Tavakoli
A novel architecture of materials and fabrication techniques is proposed that serves as a universal method for implementation of thin‐film biostickers for high resolution electrophysiological monitoring. Unlike the existing wearable patches, the presented solution can be worn for several days, and is not affected by daily routines such as physical exercise or taking bath. A printable biphasic liquid metal silver composite is used, both as the electrical interconnects and the electrodes. This allows combining advantages of dry electrodes, i.e., printability and non‐smearing behavior, with benefits of wet electrodes, i.e., high‐quality signal. A human subject study showed that these biphasic printed electrodes benefit from a lower electrode‐skin impedance compared to clinical grade Ag/AgCl electrodes. Digital printing enables autonomous fabrication of biostickers that are taylor‐made for each user and each application. A universal miniaturized electronic system for biopotential acquisition and wireless communication is develpoed, and demonstrated multiple biopotential acquisition cases, including electrocardiography, electroencephalography, electromyography, and electrooculography.

15 July 2022 in Advanced Materials Technologies
Verified
Journal Article
Open access
WZWuzhou Zu
Wuzhou Zu
YOYunsik Ohm
Yunsik Ohm
Manuel Reis CarneiroManuel Reis Carneiro
Manuel Reis Carneiro
MVMichael Vinciguerra
Michael Vinciguerra
MTMahmoud Tavakoli
Mahmoud Tavakoli
CMCarmel Majidi
Carmel Majidi
Printed soft conductive materials for stretchable electronics should have low electrical resistivity, high strain limit, and stable electrical properties when stretched. Previously, it has been shown that a bi‐phasic ink composed of silver (Ag) microflakes, eutectic gallium−indium (EGaIn) alloy, and styrene isoprene (SIS) block copolymer is a promising formulation for printed soft electronics and has the potential to satisfy the necessary criteria. In this study, further improvements to the ink formulation are explored, with a focus on how the choice of Ag microflakes affects the electrical and electromechanical properties of the composite. By using specific Ag microflakes, AgInGa‐SIS inks that have conductivity as high as 6.38 × 105 S m−1 and a strain limit of over 1000%, with low electromechanical coupling can be synthesized. More broadly, when comparing the composite with different silver flakes, there is a 176% relative difference in conductivity, >600% difference in strain limit, and 277% relative difference in electromechanical coupling. To demonstrate the applicability of these inks for various use cases such as wearable bioelectronics, interconnects are printed for connecting electronic breakout boards with microcontrollers that provide a stable electrical connection when stretched, and the interconnects and electrodes of a wearable electrocardiography system that monitors the heart pulses in real‐time.

12 July 2023 in Advanced Science
Verified
Journal Article
Open access
Manuel Reis CarneiroManuel Reis Carneiro
Manuel Reis Carneiro
AAAníbal T. de Almeida
Aníbal T. de Almeida
MTMahmoud Tavakoli
Mahmoud Tavakoli
CMCarmel Majidi
Carmel Majidi
Despite advances in soft, sticker‐like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco‐friendly conductive ink for thin‐film circuitry composed of silver flakes and a water‐based polyurethane dispersion. This ink uniquely combines high electrical conductivity (1.6 × 105 S m−1), high resolution digital printability, robust adhesion for microchip integration, mechanical resilience, and recyclability. Recycling is achieved with an ecologically‐friendly processing method to decompose the circuits into constituent elements and recover the conductive ink with a decrease of only 2.4% in conductivity. Moreover, adding liquid metal enables stretchability of up to 200% strain, although this introduces the need for more complex recycling steps. Finally, on‐skin electrophysiological monitoring biostickers along with a recyclable smart package with integrated sensors for monitoring safe storage of perishable foods are demonstrated.