The control of order and orientation of the self-assembly of cylinder-forming poly(styrene-b-dimethylsiloxane) block copolymer is demonstrated. Copolymer thin films are spun-cast onto topographically patterned (well-defined rectangular cross-section channels) polyhedral-silsesquioxane-type resist templates and annealed in solvent vapor. The templates used here are fabricated by UV-curing nanoimprint lithography and the surface properties of the resist are tuned by the ligands coordinated to the resist's silsesquioxane cages. Depending on the resist's composition and on the surface chemistry at the base of the trench (resist or silicon), various morphologies and orientations of the polydimethylsiloxane cylinders are observed without the use of a brush layer. Some surfaces are demonstrated to be neutral for the copolymer, without any wetting layer and, under favorable conditions, highly ordered features are observed over substrate areas of about 1 cm² (scalable to larger surfaces). Also, the possibility of using solvents widely accepted in industry for polymer spin-coating and annealing is proved. Due to the high plasma etch resistance of the polydimethylsiloxane block, self-assembled patterns can be transferred to the silicon substrate producing silicon features with aspect ratios up to 2. We demonstrate that the methodology developed here could be integrated into conventional fabrication processes and scaled to wafer production.

In this work, nanoimprint lithography combined with standard anodization etching is used to make perfectly organised triangular arrays of vertical cylindrical alumina nanopores onto standard −oriented silicon wafers. Both the pore diameter and the period of alumina porous array are well controlled and can be tuned: the periods vary from 80 to 460 nm, and the diameters vary from 15 nm to any required diameter. These porous thin layers are then successfully used as templates for the guided epitaxial growth of organised mono-crystalline silicon nanowire arrays in a chemical vapour deposition chamber. We report the densities of silicon nanowires up to 9 × 109 cm−2 organised in highly regular arrays with excellent diameter distribution. All process steps are demonstrated on surfaces up to 2 × 2 cm2. Specific emphasis was made to select techniques compatible with microelectronic fabrication standards, adaptable to large surface samples and with a reasonable cost. Achievements made in the quality of the porous alumina array, therefore on the silicon nanowire array, widen the number of potential applications for this technology, such as optical detectors or biological sensors.

The self-assembly of a lamellar-forming polystyrene-block-poly(dimethylsiloxane) (PS-b-PDMS) diblock copolymer (DBCP) was studied herein for surface nanopatterning. The DBCP was synthesized by sequential living anionic polymerization of styrene and hexamethylcyclotrisiloxane (D₃). The number average molecular weight (M_n), polydispersity index (M_w/M_n) and PS volume fraction (φ_ps) of the DBCP were M_n^PS = 23.0 kg mol⁻¹, M_n^PDMS = 15.0 kg mol⁻¹, M_w/M_n = 1.06 and φ_ps = 0.6. Thin films of the DBCP were cast and solvent annealed on topographically patterned polyhedral oligomeric silsesquioxane (POSS) substrates. The lamellae repeat distance or pitch (λ_L) and the width of the PDMS features (d_L) are ~35 nm and ~17 nm, respectively, as determined by SEM. The chemistry of the POSS substrates was tuned, and the effects on the self-assembly of the DBCP noted. The PDMS nanopatterns were used as etching mask in order to transfer the DBCP pattern to underlying silicon substrate by a complex plasma etch process yielding sub-15 nm silicon features.