(Member, IEEE) received the B.S. degree in applied physics from the University of Science and Technology Beijing (USTB),
Beijing, China, in 2009, and a Ph.D. degree in microelectronics and solid-state electronics from the Institute of Electronics, Chinese Academy of Sciences, Beijing, in 2014. From 2014 to 2016, he was a postdoctoral researcher with the Institute of
Microelectronics, Tsinghua University, Beijing. From 2023 to 2024, he was a Visiting Scholar with the University of Cambridge, Cambridge, U.K. He is currently an Associate Professor with the Department of Physics, USTB. His research interests include the development of microelectromechanical systems (MEMS)-based electric field sensors and instruments.
(Member, IEEE) received the B.S. degree in applied physics from the University of Science and Technology Beijing (USTB),
Beijing, China, in 2009, and a Ph.D. degree in microelectronics and solid-state electronics from the Institute of Electronics, Chinese Academy of Sciences, Beijing, in 2014. From 2014 to 2016, he was a postdoctoral researcher with the Institute of
Microelectronics, Tsinghua University, Beijing. From 2023 to 2024, he was a Visiting Scholar with the University of Cambridge, Cambridge, U.K. He is currently an Associate Professor with the Department of Physics, USTB. His research interests include the development of microelectromechanical systems (MEMS)-based electric field sensors and instruments.