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<mml:math display="inline"><mml:mrow><mml:mo>(</mml:mo><mml:mn>355</mml:mn><mml:mspace width="0.3em"></mml:mspace><mml:mi>nm</mml:mi><mml:mo>)</mml:mo></mml:mrow></mml:math>(355nm) and the KrF pulsed excimer laser <mml:math display="inline"><mml:mrow><mml:mo>(</mml:mo><mml:mn>248</mml:mn><mml:mspace width="0.3em"></mml:mspace><mml:mi>nm</mml:mi><mml:mo>)</mml:mo></mml:mrow></mml:math>(248nm) were employed to separate GaN thin films from sapphire substrates and to transfer the films to bond with other substrates. The different laser lift-off processes would generate the dislocation density on different regions. In this study, the effects of these two laser sources on structural damage mechanisms and reverse-bias leakages of InGaN–GaN light-emitting diodes (LEDs) were studied.No biography provided yet