The research and development in the field of magnetoresistive sensors has played an important role in the last few decades. Here, the authors give an introduction to the fundamentals of the anisotropic magnetoresistive (AMR) and the giant magnetoresistive (GMR) effect as well as an overview of various types of sensors in industrial applications. In addition, the authors present their recent work in this field, ranging from sensor systems fabricated on traditional substrate materials like silicon (Si), over new fabrication techniques for magnetoresistive sensors on flexible substrates for special applications, e.g., a flexible write head for component integrated data storage, micro-stamping of sensors on arbitrary surfaces or three dimensional sensing under extreme conditions (restricted mounting space in motor air gap, high temperatures during geothermal drilling).

New sensor and sensor manufacturing technologies are identified as a key factor for a successful digitalisation and are therefore economically important for manufacturers and industry. To address various requirements, a new sputter coating system has been invented at the Institute of Micro Production Technology. It enables the deposition of sensor systems directly onto technical surfaces. Compared to commercially available systems, it has no spatial limitations concerning the maximum coatable component size. Moreover, it enables a simultaneous structuring of deposited layers. Within this paper, characterisation techniques, results and challenges concerning directly deposited thin film strain gauges with the new sputter coating system are presented. Constantan (CuNiMn 54/45/1) and NiCr 80/20 are used as sensor materials. The initial resistance, temperature coefficient of resistance and gauge factor/k-factor of quarter-bridge strain gauges are characterised. The influence of a protective layer on sensor behaviour and layer adhesion is investigated as well. Moreover, the temperature compensation quality of directly deposited half-bridge strain gauges is evaluated, optimised with an external trimming technology and benchmarked against commercial strain gauges. Finally, the suitability for high-temperature strain measurement is investigated. Results show a maximum operation temperature of at least 400 °C, which is above the current state-of-the-art of commercial foil-based metal strain gauges.

This paper presents the design, fabrication, and characterization of on silicon integrated magnetics for high frequency power applications. The presented device achieves superior characteristics in terms of energy density, electrical resistance, current capability, and inductance vs frequency stability. In order to demonstrate the effectiveness of use of the presented device for high frequency power applications, it is tested with two different buck point of load (PoL) dc-dc converters, one of them is off-shelf chipset and the other is designed specifically for the microdevice. Experimental measurements show that the microdevices achieve a maximum inductance of about 50nH, electrical resistance of 300mΩ, rated current capabilities up to 1A, and stable L vs f characteristics up to 100MHz. Also, the PoL buck converters with the microdevices achieve a peak efficiency of up to 82% with a flat efficiency curve at switching frequencies up to 30MHz while providing tight output voltage regulation (<0.2%) and low temperature rise (40°C) at the rated current.

Background: Commonly, polymer foil-based strain gauges are used for the incremental hole drilling method to obtain residual stress depth profiles. These polymer foil-based strain gauges are prone to errors due to application by glue. For example zero depth setting is thus often erroneous due to necessary removal of polymer foil and glue. This is resulting in wrong use of the calibration coefficients and depth resolution and thus leading to wrong calculations of the obtained residual stress depth profiles. Additionally common polymer foil-based sensors are limited in their application regarding e.g. exposure to high temperatures. Objective: This paper aims at a first step into the qualification of directly deposited thin film strain gauges for use with the incremental hole drilling method. With the directly deposited sensors, uncertainties regarding the determination of calibration coefficients and zero depth setting due to the absence of glue can be reduced to a minimum. Additionally, new areas of interest such as the investigation of thermally sprayed metallic layers can be addressed by the sensors due to their higher temperature resilience and their component inherent minimal thickness. Methods: For the first time, different layouts of directly deposited thin film strain gauges for residual stress measurements were manufactured on a stainless steel specimen. Strain measurements during incremental hole drilling using a bespoke hole drilling device were conducted. Residual stress depth profiles were calculated using the Integral method of the ASTM E837 standard. Afterwards, strain measurements with conventional polymer foil-based strain gauges during incremental hole drilling were conducted and residual stress depth profiles were calculated accordingly. Finally the obtained profiles were compared regarding characteristic values. Results: The residual stress depth profiles obtained from directly deposited strain gauges generally match the ones obtained from conventional polymer foil based strain gauges. With the novel strain gauges, zero depth setting is simplified due to the absence of glue and polymer foil. With the direct deposition, a wide variety of rosette designs is possible, enabling a more detailed evaluation of the strain field around the drilled hole. Conclusions: The comparative analysis of the obtained residual stress depth profiles shows the general feasibility of directly deposited strain gauges for residual stress measurements. Detailed investigations on uncertainty sources are still necessary.

In the context of intelligent components in industrial applications in the automotive, energy or construction sector, sensor monitoring is crucial for security issues and to avoid long and costly downtimes. This article discusses component-inherent thin-film sensors for this purpose, which, in contrast to conventional sensor technology, can be applied inseparably onto the component’s surface via sputtering, so that a maximum of information about the component’s condition can be generated, especially regarding deformation. This article examines whether the sensors can continue to generate reliable measurement data even after critical component loads have been applied. This extends their field of use concerning plastic deformation behavior. Therefore, any change in sensor properties is necessary for ongoing elastic strain measurements. These novel fundamentals are established for thin-film constantan strain gauges and platinum temperature sensors on steel substrates. In general, a k-factor decrease and an increase in the temperature coefficient of resistance with increasing plastic deformation could be observed until a sensor failure above 0.5% plastic deformation (constantan) occurred (1.3% for platinum). Knowing these values makes it possible to continue measuring elastic strains after critical load conditions on a machine component in terms of plastic deformation. Additionally, a method of sensor-data fusion for the clear determination of plastic deformation and temperature change is presented.

Quantum technology became a new tool for navigation based on measuring accelerations and rotations. However, the full potential of atom interferometers that operate with ultracold atoms has not yet been exploited. This paper presents current developments in the field of generation and application of Bose–Einstein condensates for inertial navigation. It covers the advancements in the form of atom chip and compact vacuum technology, classical sensor hybridization, and a multi-axis atom interferometry technique. In addition, the synergies of combining quantum sensors with classical inertial measurement units and their implications for navigation trajectories are discussed.