New sensor and sensor manufacturing technologies are identified as a key factor for a successful digitalisation and are therefore economically important for manufacturers and industry. To address various requirements, a new sputter coating system has been invented at the Institute of Micro Production Technology. It enables the deposition of sensor systems directly onto technical surfaces. Compared to commercially available systems, it has no spatial limitations concerning the maximum coatable component size. Moreover, it enables a simultaneous structuring of deposited layers. Within this paper, characterisation techniques, results and challenges concerning directly deposited thin film strain gauges with the new sputter coating system are presented. Constantan (CuNiMn 54/45/1) and NiCr 80/20 are used as sensor materials. The initial resistance, temperature coefficient of resistance and gauge factor/k-factor of quarter-bridge strain gauges are characterised. The influence of a protective layer on sensor behaviour and layer adhesion is investigated as well. Moreover, the temperature compensation quality of directly deposited half-bridge strain gauges is evaluated, optimised with an external trimming technology and benchmarked against commercial strain gauges. Finally, the suitability for high-temperature strain measurement is investigated. Results show a maximum operation temperature of at least 400 °C, which is above the current state-of-the-art of commercial foil-based metal strain gauges.

Background: Commonly, polymer foil-based strain gauges are used for the incremental hole drilling method to obtain residual stress depth profiles. These polymer foil-based strain gauges are prone to errors due to application by glue. For example zero depth setting is thus often erroneous due to necessary removal of polymer foil and glue. This is resulting in wrong use of the calibration coefficients and depth resolution and thus leading to wrong calculations of the obtained residual stress depth profiles. Additionally common polymer foil-based sensors are limited in their application regarding e.g. exposure to high temperatures. Objective: This paper aims at a first step into the qualification of directly deposited thin film strain gauges for use with the incremental hole drilling method. With the directly deposited sensors, uncertainties regarding the determination of calibration coefficients and zero depth setting due to the absence of glue can be reduced to a minimum. Additionally, new areas of interest such as the investigation of thermally sprayed metallic layers can be addressed by the sensors due to their higher temperature resilience and their component inherent minimal thickness. Methods: For the first time, different layouts of directly deposited thin film strain gauges for residual stress measurements were manufactured on a stainless steel specimen. Strain measurements during incremental hole drilling using a bespoke hole drilling device were conducted. Residual stress depth profiles were calculated using the Integral method of the ASTM E837 standard. Afterwards, strain measurements with conventional polymer foil-based strain gauges during incremental hole drilling were conducted and residual stress depth profiles were calculated accordingly. Finally the obtained profiles were compared regarding characteristic values. Results: The residual stress depth profiles obtained from directly deposited strain gauges generally match the ones obtained from conventional polymer foil based strain gauges. With the novel strain gauges, zero depth setting is simplified due to the absence of glue and polymer foil. With the direct deposition, a wide variety of rosette designs is possible, enabling a more detailed evaluation of the strain field around the drilled hole. Conclusions: The comparative analysis of the obtained residual stress depth profiles shows the general feasibility of directly deposited strain gauges for residual stress measurements. Detailed investigations on uncertainty sources are still necessary.

This paper shows, that in comparison to conventional polymer foil-based metal strain gauges, sputtered thin-film metal strain gauges enable new measurement positions in harsh environments because of their reduced thickness, fulfilling the modern needs of special industry applications such as drilling bottom hole assemblies. It requires the possibility to sputter directly on components of any size. This is achieved by a novel patented coating system, invented at the IMPT. Due to the direct deposition, there is potential for optimized temperature behavior and higher accuracy that should be shown in this work. After the development of Constantan strain gauges with a low temperature coefficient of resistance (TCR) of -51.5 ppm/°C and a temperature-independent k-factor of 2.05, half-bridge measurement results showed an outstanding temperature compensation capability with a corrected maximum error of just 10 µm/m up to 210 °C while being exposed to varying strain.

In the context of intelligent components in industrial applications in the automotive, energy or construction sector, sensor monitoring is crucial for security issues and to avoid long and costly downtimes. This article discusses component-inherent thin-film sensors for this purpose, which, in contrast to conventional sensor technology, can be applied inseparably onto the component’s surface via sputtering, so that a maximum of information about the component’s condition can be generated, especially regarding deformation. This article examines whether the sensors can continue to generate reliable measurement data even after critical component loads have been applied. This extends their field of use concerning plastic deformation behavior. Therefore, any change in sensor properties is necessary for ongoing elastic strain measurements. These novel fundamentals are established for thin-film constantan strain gauges and platinum temperature sensors on steel substrates. In general, a k-factor decrease and an increase in the temperature coefficient of resistance with increasing plastic deformation could be observed until a sensor failure above 0.5% plastic deformation (constantan) occurred (1.3% for platinum). Knowing these values makes it possible to continue measuring elastic strains after critical load conditions on a machine component in terms of plastic deformation. Additionally, a method of sensor-data fusion for the clear determination of plastic deformation and temperature change is presented.

Many industrial production processes use sensors to generate information about the manufacturing process. In this way, monitoring machine tools ensures the proper functionality of the system and detects unexpected behavior due to, for example, material inhomogeneity, incorrect data input, temperature influence or tool wear. In large production machines, such as portal milling machines, the sensor equipment of guide carriages can be an important possibility since they are a standardized component and can be easily integrated into existing machines. Here, conventional polymer foil-based strain gauges show several disadvantages due to reproducibility and reliability of the sensor connection via adhesive. Thus, this article addresses the manufacturing of directly-deposited chromium thin-film strain gauges on a guide carriage with integrated programmable data pre-amplification. Tests with different sensor materials on steel substrates showed that chromium was the most suitable sensor material with a high k-factor. Then, one end face of the carriage was polished before sputtering an Al ₂ O ₃ insulation layer and a chromium sensor layer that was laser-structured afterward to produce two Wheatstone full-bridges at previously simulated sensor positions. In a tensile test stand, the calibration of the sensors took place in the two spatial directions perpendicular to the guide rail direction. With an additional sensor data fusion for the final interpretation of measured forces, it is shown that this sensor technology is suitable for force measurement at guide carriages.

Precision machining is becoming more and more important with the increasing demands on surface quality for various components. This applies, for example, to mirror components in micro-optics or cooling components in microelectronics. Copper is a frequently used material for this purpose, but its mechanical properties make it difficult to machine. In this study, a process strategy for finishing copper surfaces with batch-manufactured micro-grinding tools in an electrochemically assisted grinding process is demonstrated. The tool heads are manufactured from a polyimide-abrasive-suspension and silicon as a carrier substrate using microsystems technology. The matching shafts are milled from aluminium. The tools are then used on pure copper and oxidised copper surfaces. By using finer abrasives grains (1.6–2.4 µm instead of 4–6 µm) than previously, similar surface roughness values could be achieved (R_a = 0.09 ± 0.02 µm, R_z = 1.94 ± 0.73 µm) with the same grinding process. An optimised grinding process that combines the use of rough and fine tools, on the other hand, achieves significantly better surface finishes in just four grinding iterations (R_a = 0.02 ± 0.01 µm, R_z = 0.83 ± 0.21 µm). In order to achieve a further increase in surface quality, this optimised grinding process is combined with the anodic oxidation of the copper workpieces. The surface modification is done to increase the machinability of the surface by creating an oxide layer. This is confirmed by the results of scratch tests carried out, which showed less force acting on the tool during machining with the oxide layer than with a pure copper surface. To realise this within the machine tool, an electrochemical cell is shown that can be integrated into the machine so that the oxidation can be carried out immediately before the grinding process. The copper layers produced inside the electrochemical cell in the machine tool show similar characteristics to the samples produced outside. Processing the oxidised samples with the optimised grinding process led to a further reduction of about 17% in the R_z values (R_a = 0.03 ± 0.01 µm, R_z = 0.69 ± 0.20 µm). The combination of the shown grinding process and the integration of anodic oxidation within the machine tool for the surface modification of copper workpieces seems to be promising to achieve high surface finishes.