This invited paper presents potential solutions for tackling some of the main underlying challenges toward developing sustainable Internet-of-things (IoT) devices with a focus on eco-friendly manufacturing, sustainable powering, and wireless connectivity for next-generation IoT devices. The diverse applications of IoT systems, such as smart cities, wearable devices, self-driving cars, and industrial automation, are driving up the number of IoT systems at an unprecedented rate. In recent years, the rapidly-increasing number of IoT devices and the diverse application-specific system requirements have resulted in a paradigm shift in manufacturing processes, powering methods, and wireless connectivity solutions. The traditional cloud-centering IoT systems are moving toward distributed intelligence schemes that impose strict requirements on IoT devices, e.g., operating range, latency, and reliability. In this article, we provide an overview of hardware-related research trends and application use cases of emerging IoT systems and highlight the enabling technologies of next-generation IoT. We review eco-friendly manufacturing for next-generation IoT devices, present alternative biodegradable and eco-friendly options to replace existing materials, and discuss sustainable powering IoT devices by exploiting energy harvesting and wireless power transfer. Finally, we present (ultra-)low-power wireless connectivity solutions that meet the stringent energy efficiency and data rate requirements of future IoT systems that are compatible with a batteryless operation.

In this paper, the bonding-wire interconnection has been studied from the points of view of its modeling and electrical characterization. Both singleand double-wire structures have been considered, the latter under the assumption of parallel wires. Two electrical models of the bonding wire are discussed. First, the finite-difference time-domain (FDTD) method is proposed for the rigorous analysis of such structures. This method uses a suitable discretization technique, which accounts for the wire curvature by means of a polygonal approximation. A quasi-static model of the bonding wire, suitable for commercial microwave computer-aided-design tools is then proposed. This model is based on the representation of the structure with four sections of a uniform transmission line and the model parameters are evaluated analytically from the dimensions of the interconnection. Accuracy and applicability of the quasi-static model have been assessed by analyzing several test structures, the reference results being obtained with the FDTD method. Finally, the quasi-static model has been used to provide an extensive electrical characterization of the bonding wire versus its main geometrical parameters. This characterization is given in terms of an equivalent series inductance and two equivalent shunt capacitances forming a /spl pi/ low-pass network. This representation is particularly useful in the matching of the bonding-wire discontinuity.

Radio frequency (RF) energy harvesting and wireless power transmission (WPT) technologies —both near-field and far-field—have attracted significant interest for wireless applications and RFID systems. We already utilize near-field WPT products in our life and it is expected that RF EH and far-field WPT systems can drive the future low-power wireless systems. In this article, we initially present a brief historical overview of these technologies. The main technical challenges of rectennas and WPT transmitters are discussed. Furthermore, this paper presents the recent advances on the development of these technologies, including the possibility of powering RFID systems through the millimeter wave power from 5G networks, the trends in flexible rectennas design and the technological developments on the simultaneous wireless information and power transfer (SWIPT).

Energy harvesting is well established as one of the prominent enabling technologies [along with radio-frequency identification (RFID), wireless power transfer, and green electronics] for the pervasive development of Internet of Things (IoT). This paper focuses on a particular, yet broad, class of systems that falls in the IoT category of large area electronics (LAE). This class is represented by “smart surfaces.” The paper, after an introductory overview about how smart surfaces are collocated in the IoT and LAE scenario, first deals with technologies and architectures involved, namely, materials, antennas, RFID systems, and chipless structures; then, some exemplifying solutions are illustrated to show the present development of these concurrent technologies in this area and to stimulate further solutions. Conclusions and future trends are then drawn.

Radio-Frequency IDentification (RFID) devices and sensors are among the main innovations of the last years, with an enormous impact on the Internet of Things (IoT) physical communication layer as well as on logistics and robotics. The aim of the present paper is to review the main technologies available for RFID sensors, and to identify the corresponding state-of-the-art when these technologies are applied to realistic IoT scenarios. Firstly, the concepts of radio backscattering and harmonic backscattering are analyzed, highlighting the pros and cons of each approach. Then, state-of-the-art solutions are reported, and the performance of each of them are discussed, to provide an overview of the potential of RFID-based sensing in different scenarios.

This paper describes the design and realization of a 5.6-GHz ultrawide-bandwidth-based position measurement system. The system was entirely made using off-the-shelf components and achieves centimeter-level accuracy in an indoor environment. It is based on asynchronous modulated pulse round-trip time measurements. Both system level and realization details are described along with experimental results including estimates of measurement uncertainties.