This contribution presents an overview of advances in scanning micromirrors based on MEMS (Micro-electro-mechanical systems) technologies to achieve beam scanning for OCT (Optical Coherence Tomography). The use of MEMS scanners for miniaturized OCT probes requires appropriate optical architectures. Their design involves a suitable actuation mechanism and an adapted imaging scheme in terms of achievable scan range, scan speed, low power consumption, and acceptable size of the OCT probe. The electrostatic, electromagnetic, and electrothermal actuation techniques are discussed here as well as the requirements that drive the design and fabrication of functional OCT probes. Each actuation mechanism is illustrated by examples of miniature OCT probes demonstrating the effectiveness of in vivo bioimaging. Finally, the design issues are discussed to permit users to select an OCT scanner that is adapted to their specific imaging needs.

This paper introduces an optical 2-axis Micro Electro-Mechanical System (MEMS) micromirror actuated by a pair of electrothermal actuators and a set of passive torsion bars. The actuated element is a dual-reflective circular mirror plate of 1 $\mathrm{m}\mathrm{m}$ in diameter. This inner mirror plate is connected to a rigid frame via a pair of torsion bars in two diametrically opposite ends located on the rotation axis. A pair of electrothermal bimorphs generates a force onto the perpendicular free ends of the mirror plate in the same angular direction. An array of electrothermal bimorph cantilevers deflects the rigid frame around a working angle of 45 ${}^{\circ }$ for side-view scan. The performed scans reach large mechanical angles of 32 ${}^{\circ }$ for the frame and 22 ${}^{\circ }$ for the in-frame mirror. We denote three resonant main modes, pure flexion of the frame at 205 $\mathrm{Hz}$ , a pure torsion of the mirror plate at 1.286 $\mathrm{kHz}$ and coupled mode of combined flexion and torsion at 1.588 $\mathrm{kHz}$ . The micro device was fabricated through successive stacks of materials onto a silicon-on-insulator wafer and the patterned deposition on the back-side of the dual-reflective mirror is achieved through a dry film photoresist photolithography process.

The stability and accuracy of atomic devices can be degraded by the evolution of their cell inner atmosphere. Hence, the undesired entrance or leakage of background or buffer gas, respectively, that can permeate through the cell walls, should be slowed down. In this work, we investigate helium permeation in microfabricated alkali vapor cells filled with He and whose windows are made of borosilicate glass (BSG) or aluminosilicate glass (ASG). The permeation is then derived from routine measurements of the pressure-shifted hyperfine transition frequency of an atomic clock. We first confirm that ASG reduces the He permeation rate by more than two orders of magnitude, in comparison to BSG. In addition, we demonstrate that Al2O3 thin-film coatings, known to avoid alkali consumption in vapor cells, can also significantly reduce He permeation. The permeation through BSG is thereby reduced by a factor up to 130, whereas the one through ASG is decreased by a factor up to 5.0 compared to uncoated substrates. These results may contribute to the development of miniaturized atomic clocks and sensors with improved long-term stability or sensitivity.

This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on 45 ^° saw-dicing of glass substrates, allows rapid and low-cost processing. In particular, it leads to high compactness and possibility of wafer-level alignment/assembly, suitable for vertically integrated imaging micro-instruments. The device, including additional out-of plane reflection for extraction of sensing beam, can be as small as 1 mm³.

Phononic coupled-resonator waveguide cavities are formed by a finite chain of defects in a complete bandgap phononic crystal slab. The sample is machined in a fused silica plate by femtosecond printing to form an array of cross-shape holes. The collective resonance of the phononic cavities, in the Megahertz frequency range, are excited by a piezoelectric vibrator and imaged by laser Doppler vibrometry. It is found that well-defined resonant cavity modes can be efficiently excited, even though the phononic cavities are distant by a few lattice spacings and are only weakly coupled through evanescent elastic waves. The results suggest the possibility of engineering the dynamical response of a set of coupled phononic cavities by an adequate layout of defects in a phononic crystal slab.

Microfluidics integration of acoustic biosensors is an actively developing field. Despite significant progress in “passive” microfluidic technology, integration with microacoustic devices is still in its research state. The major challenge is bonding polymers with monocrystalline piezoelectrics to seal microfluidic biosensors. In this contribution, we specifically address the challenge of microfluidics integration on gallium arsenide (GaAs) acoustic biosensors. We have developed a robust plasma-assisted bonding technology, allowing strong connections between PDMS microfluidic chip and GaAs/SiO₂ at low temperatures (70 °C). Mechanical and fluidic performances of fabricated device were studied. The bonding surfaces were characterized by water contact angle measurement and ATR-FTIR, AFM, and SEM analysis. The bonding strength was characterized using a tensile machine and pressure/leakage tests. The study showed that the sealed chips were able to achieve a limit of high bonding strength of 2.01 MPa. The adhesion of PDMS to GaAs was significantly improved by use of SiO₂ intermediate layer, permitting the bonded chip to withstand at least 8.5 bar of burst pressure. The developed bonding approach can be a valuable solution for microfluidics integration in several types of MEMS devices.