This paper introduces an optical 2-axis Micro Electro-Mechanical System (MEMS) micromirror actuated by a pair of electrothermal actuators and a set of passive torsion bars. The actuated element is a dual-reflective circular mirror plate of 1 $\mathrm{m}\mathrm{m}$ in diameter. This inner mirror plate is connected to a rigid frame via a pair of torsion bars in two diametrically opposite ends located on the rotation axis. A pair of electrothermal bimorphs generates a force onto the perpendicular free ends of the mirror plate in the same angular direction. An array of electrothermal bimorph cantilevers deflects the rigid frame around a working angle of 45 ${}^{\circ }$ for side-view scan. The performed scans reach large mechanical angles of 32 ${}^{\circ }$ for the frame and 22 ${}^{\circ }$ for the in-frame mirror. We denote three resonant main modes, pure flexion of the frame at 205 $\mathrm{Hz}$ , a pure torsion of the mirror plate at 1.286 $\mathrm{kHz}$ and coupled mode of combined flexion and torsion at 1.588 $\mathrm{kHz}$ . The micro device was fabricated through successive stacks of materials onto a silicon-on-insulator wafer and the patterned deposition on the back-side of the dual-reflective mirror is achieved through a dry film photoresist photolithography process.

OCT instruments permit fast and non-invasive 3D optical biopsies of biological tissues. However, they are bulky and expensive, making them only affordable at the hospital and thus, not sufficiently used as an early diagnostic tool. Significant reduction of system cost and size is achieved by implementation of MOEMS technologies. We propose an active array of 4x4 Mirau microinterferometers where the reference micro-mirrors are carried by a vertical comb-drive microactuator, enabling the implementation of the phase-shifting technique that improves the sensitivity and eliminates unwanted interferometric terms. We focus on the design of the imaging system, the microfabrication and the assembly of the Mirau microinterferometer, and the swept-source OCT imaging.

In the rapid evolution of gastrointestinal endomicroscopy, optical coherence tomography (OCT) has found many diverse applications. Until recently, the micro-opto–electro-mechanical systems (MOEMS) technology has been playing a key role in shaping the miniaturization of these components. We report here, to the best of our knowledge, a novel endoscopic microsystem. It is based on a spectrally tuned MOEMS Mirau micro-interferometer integrated with micro-electro-mechanical systems (MEMS) electro-thermal micro-scanner, operating in the regime of swept-source (SS) OCT imaging. This Letter validates our initial proof-of-concept toward the development of such MOEMS probe and the presentation of experimental performances of the resulting SS-OCT microsystem.

In this paper, we investigate the influence of different masking parameters onto the surface quality of the {111} sidewalls in order to generate specifically deep cavities by wet-anisotropic-etching of bulk silicon, for optical sensors using cavity sidewalls as reflectors. Mask alignment with crystal planes prior to wet-etching is found to be essential in order to avoid the appearance of additional planes during long etching. Mask deposition processes have been also evaluated. Among the different employed mask materials, Cr/Au gives the best results. It is then shown that cavities as deep as 1 mm with low roughness sidewalls can be simply produced with potassium hydroxide solution with periodic piranha cleaning.

We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.

Thin films are a type of coating that have a very wide spectrum of applications. They may be used as single layers or composed in multilayer stacks, which significantly extend their applications. One of the most commonly used material for thin films is silicon dioxide, SiO₂. Although there are other tools that can be used to measure the thickness of SiO₂ films, these tools are very complex and sophisticated. In this article, we propose the use of an exponential two-layer light-material interaction model, throughout its diffuse reflectance spectra, as an alternative for the measurement of the thickness of evaporated SiO₂ on Si wafers. The proposed model is evaluated experimentally by means of a 980-nm-thick SiO₂ layer evaporated on a Si wafer. The results show that the proposed model has a strong correlation with the thickness measurements obtained using commercial equipment.