Matic Krivec

Dr. Matic Krivec


Research Focus & Metrics

Academic Career Length

12Years (2015-Present)

(Calculated once Scilit publication data is synced: current year − year of first publication + 1)

Representative Publications

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6 November 2015 in Sensors
Verified
Journal Article
Open access
PDF file
MKMatic Krivec
Matic Krivec
GGGerald Mc Gunnigle
Gerald Mc Gunnigle
AAAnze Abram
Anze Abram
DMDieter Maier
Dieter Maier
RWRoland Waldner
Roland Waldner
RLRaimund Leitner
Raimund Leitner
The sensitivity of two commercial metal oxide (MOx) sensors to ethylene is tested at different relative humidities. One sensor (MiCS-5914) is based on tungsten oxide, the other (MQ-3) on tin oxide. Both sensors were found to be sensitive to ethylene concentrations down to 10 ppm. Both sensors have significant response times; however, the tungsten sensor is the faster one. Sensor models are developed that predict the concentration of ethylene given the sensor output and the relative humidity. The MQ-3 sensor model achieves an accuracy of ±9.2 ppm and the MiCS-5914 sensor model predicts concentration to ±7.0 ppm. Both sensors are more accurate for concentrations below 50 ppm, achieving ±6.7 ppm (MQ-3) and 5.7 ppm (MiCS-5914).

1 September 2018 in Materials Characterization
Verified
Journal Article
Closed access
Lisa-Marie FallerLisa-Marie Faller
Lisa-Marie Faller
MKMatic Krivec
Matic Krivec
AAAnze Abram
Anze Abram
HZHubert Zangl
Hubert Zangl

22 November 2017 in Microsystem Technologies
Verified
Journal Article
Closed access
PDF file
MKMatic Krivec
Matic Krivec
MLMartin Lenzhofer
Martin Lenzhofer
TMThomas Moldaschl
Thomas Moldaschl
JPJaka Pribošek
Jaka Pribošek
AAAnže Abram
Anže Abram
MOMichael Ortner
Michael Ortner

29 August 2017 in Proceedings
Verified
Conference Paper
Open access
PDF file
MKMatic Krivec
Matic Krivec
Ali RoshanghiasAli Roshanghias
Ali Roshanghias
ABAlfred Binder
Alfred Binder
A rapid advanced packaging concept, consisting of inkjet photopolymer printing and Ag nanoparticles printing, was investigated for the construction of a pressure sensor package. Acrylate-type 3D package housing with 7 through-holes was printed with a polyjet printer and the through-vias and connection pads were manufactured via Ag glue dispensing and inkjet printing of Ag nanoparticle ink. The flip-chip packaging concept was pursued for the electrical connection between the package and the pressure sensor dye.

30 May 2017
Verified
Conference Paper
Closed access
PDF file
MKMatic Krivec
Matic Krivec
RLRaimund Leitner
Raimund Leitner
FÜFlorian Überall
Florian Überall
JHJohannes Hochleitner
Johannes Hochleitner