In this study, a combination of Al–12Si and Al–20Si (Al–(12-20)Si) alloys was fabricated by selective laser melting (SLM) as a result of increased component requirements such as geometrical complexity and high dimensional accuracy. The microstructure and mechanical properties of the SLM Al–(12-20)Si in as-produced as well as in heat-treated conditions were investigated. The Al–(12-20)Si interface was in the as-built condition and it gradually became blurry until it disappeared after heat treatment at 673 K for 6 h. This Al–(12-20)Si bi-material displayed excellent mechanical properties. The hardness of the Al–20Si alloy side was significantly higher than that of the Al–12Si alloy side and the disparity between both sides gradually decreased and tended to be consistent after heat treatment at 673 K for 6 h. The tensile strength and elongation of the Al–(12-20Si) bi-material lies in between the Al–12Si and Al–20Si alloys and fracture occurs in the Al–20Si side. The present results provide new insights into the fabrication of bi-materials using SLM.

The Al-20Si-5Fe-3Cu-1Mg alloy was fabricated using selective laser melting (SLM). The microstructure and properties of the as-prepared SLM, post-treated SLM, and SLM with substrate plate heating are studied. The as-prepared SLM sample shows a non-uniform microstructure with four different phases: fcc-αAl, eutectic Al-Si, Al₂MgSi, and δ-Al₄FeSi₂. With thermal treatment, the phases become coarser and the δ-Al₄FeSi₂ phase transforms partially to β-Al₅FeSi. The sample produced with SLM substrate plate heating shows a relatively uniform microstructure without a distinct difference between hatch overlaps and track cores. Room temperature compression test results show that an as-prepared SLM sample reaches a maximum strength (862 MPa) compared to the heat-treated (524 MPa) and substrate plate heated samples (474 MPa) due to the presence of fine microstructure and the internal stresses. The reduction in strength of the sample produced with substrate plate heating is due to the coarsening of the microstructure, but the plastic deformation shows an improvement (20%). The present observations suggest that substrate plate heating can be effectively employed not only to minimize the internal stresses (by impacting the cooling rate of the process) but can also be used to modulate the mechanical properties in a controlled fashion.