Single event burnout (SEB) of enhancement mode GaN high-electron mobility transistors (HEMTs) under heavy ion irradiation is systematically studied based on simulations in this work. Susceptibility to SEB of different particle incidence environments is investigated to determine the device's sensitive position. Under these conditions, the mechanism of SEB in enhancement mode HEMTs is mainly associated with the charge congestion and subsequent continuous impact ionization. A hardened HEMT structure with the gate and drain double field plates is proposed correspondingly. Apart from better output characteristics and almost 25% improvement of breakdown voltage, the hardened structure also demonstrates better tolerance of SEB. This hardened structure can modify the electric field in the high field region so that charge accumulation is reduced significantly, thus effectively decreasing the possibility of SEB's occurrence. With a vertical heavy ion strike of 63.8 MeV ·cm ² /mg linear energy transfer (LET), SEB threshold voltage of the conventional structure HEMT is 160 V, while that of the hardened structure HEMT is much higher, reaching 249 V. Besides, the hardened device exhibits better SEB tolerance than the conventional device even at different higher LET conditions. Furthermore, the contribution to SEB tolerance of each field plate is also discussed.

In recent years, 3-D GaN-based transistors have been intensively studied for their dramatically improved performance. However, thermal analysis of such devices is often oversimplified using the conventional Fourier's law in thermal simulations. In this aspect, accurate temperature predictions can be achieved by coupled phonon and electron Monte Carlo (MC) simulations that track the movement and scattering of individual phonons and electrons. Based on these MC simulations for the transistor region and the Fourier's law analysis for the rest of the chip, accurate electrothermal simulations are carried out on a nanowire-based GaN transistor to reveal the temperature rise in such devices.

Continuous diamond films with low dislocation density were obtained by two-step epitaxial lateral overgrowth (ELO). Grooves were fabricated by inductively coupled plasma etching. Mo/Pd stripes sputtered in the grooves were used to inhibit the propagation of dislocations originating from the diamond substrate. Coalescent diamond films were achieved by ELO via microwave plasma-enhanced chemical vapor deposition. Etch-pits were formed intentionally to characterize the quality of the epitaxial films and distinguish different growth areas, as dislocations served as preferential sites for etching. In the window regions, a high density of dislocations, displayed as dense etch-pits, was generated. By contrast, the etch-pit density was clearly lower in the overgrowth regions. After the second ELO step, the dislocation density was further decreased. Raman spectroscopy analysis suggested that the lateral overgrowth of diamond is a promising method for achieving low dislocation density films.