Thermal simulation equipment (TSE) was recently developed to simulate the solidification process in the industrial continuous casting of slab. The grain growth, solid-liquid interface movement, and columnar-to-equiaxed transition (CET) in the continuous casting process can be reproduced using this equipment. The current study is focused on the effects of different cooling rates and superheat conditions on the grain growth in the solidification process of chromium-saving ferritic stainless steel (B425). The temperature distribution and microstructure evolution are simulated by a Cellular Automaton-Finite Element (CAFE) model. The experimental results demonstrate that the temperature gradient and the grain growth rate of the sample can be effectively controlled by the equipment. It is observed from optical micrographs of the microstructure that the average equiaxed grain ratio increases when the superheat temperature decreases. The average equiaxed grain ratio is approximately 26% and 42% under superheat conditions of 40 °C and 30 °C, respectively, and no apparent columnar grain generation in the samples occurs under superheat conditions of 10 °C and 20 °C, as the result of a large thermal resistance at the copper-sample interface and low superheat inside the sample. A lower cooling rate results in a higher equiaxed crystal ratio in the sample. As the cooling rate decreases, the equiaxed crystal ratio becomes 14%, 23%, and 42%. Comparing the simulation results with the experimental observations, a reasonable qualitative agreement is achieved for the chilled layer thickness, grain morphology, and CET in the sample. Thus, the CAFE model in the current study can accurately predict the grain growth under different superheating and cooling rate conditions.

With the advent of the 5G era, thermal management materials for electronic packaging are evolving towards high thermal conductivity, good thermal expansion matching, low density, and integrated functional structures. Copper-carbon composite materials, leveraging the advantages of copper such as high strength, hardness, electrical and thermal conductivity, as well as the excellent mechanical, electrical, and thermal properties of carbon materials, have become one of the focal points in thermal management material research. This article provides an overview of the research progress on copper-carbon composite materials, highlighting the characteristics of different carbon materials (Diamond, Carbon nanotubes, Graphene, Graphite flakes, Graphite films, Carbon fibers) in combination with copper, as well as the preparation methods for copper-carbon composites. At present, the thermal conductivity can be increased to more than 600 W/(m·K), and the preparation method is hot pressing sintering. It discusses the main issues and control methods encountered in the preparation and application of copper-carbon composites and presents prospects for the future development of these materials, offering references for the research and preparation of copper-carbon composites.